Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
N800AH-160-160-3.0

N800AH-160-160-3.0

THERMAL PAD, SHEET 160X160MM, TH

4

PK504-160-160-2.5

PK504-160-160-2.5

THERMAL PAD, SHEET 160X160MM, TH

4

TG-A1250-5-5-0.5

TG-A1250-5-5-0.5

t-Global Technology

THERM PAD A1250 5X5X0.5MM

9845

TG-A4500-30-30-2.0

TG-A4500-30-30-2.0

t-Global Technology

THERM PAD A4500 30X30X2MM

15

EYG-A091201DM

EYG-A091201DM

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

18

TG-A6200-325-325-4.0

TG-A6200-325-325-4.0

t-Global Technology

SILICONE THERMAL PAD 325X325X4.0

0

5583S 210 MM X 300 MM 1.0 MM

5583S 210 MM X 300 MM 1.0 MM

3M

THERM PAD 300MMX210MM WHITE

80

CD-02-05-247

CD-02-05-247

Wakefield-Vette

THERM PAD 24.13MMX19.05MM ORANGE

12668

12.8MM-19MM-25-8810

12.8MM-19MM-25-8810

3M

THERM PAD 19MMX12.8MM 1=25/PK

0

TI900-10-50-0.12-0

TI900-10-50-0.12-0

t-Global Technology

THERM PAD 50MMX10MM WHITE

183

A15330-03

A15330-03

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GREEN

0

EYG-S0509ZLGK

EYG-S0509ZLGK

Panasonic

THERM PAD 92MMX46MM GRAY

28

3M 8805 SQUARE-8MM-500

3M 8805 SQUARE-8MM-500

3M

THERM PAD 8MMX8MM W/ADH 500/PK

342

8810-TO218

8810-TO218

3M

THERM PAD W/ADH WHITE

0

COH-1016LVC-400-05-1NT

COH-1016LVC-400-05-1NT

Taica Corporation

THERMAL INTERFACE PAD, GAP PAD,

0

21MM-21MM-25-5590H-05

21MM-21MM-25-5590H-05

3M

THERM PAD 21MMX21MM GRAY 1=25/PK

7

BS75K-160-160-1.5

BS75K-160-160-1.5

THERMAL PAD, SHEET 160X160MM, TH

4

SPK10-0.006-00-34

SPK10-0.006-00-34

Henkel / Bergquist

THERM PAD 25.4MMX19.05MM BEIGE

0

DC0019/03-TG-A486G-0.3-2A

DC0019/03-TG-A486G-0.3-2A

t-Global Technology

THERM PAD 31.75MMX31.75MM W/ADH

106

SPK10-0.006-00-25

SPK10-0.006-00-25

Henkel / Bergquist

THERM PAD 25.4MMX6.6MM BEIGE

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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