| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
|
t-Global Technology |
THERMAL PAD 385X285MM DARK GREY |
10 |
|
|
|
Panasonic |
THERM PAD 61X127.5X0.35MM GRAY |
0 |
|
|
|
Panasonic |
THERM PAD 115MMX90MM W/ADH WHITE |
5 |
|
|
|
t-Global Technology |
SILICONE THERMAL PAD 160X160X1.0 |
96 |
|
|
|
t-Global Technology |
THERMAL PAD 385X285MM BLUE |
10 |
|
|
|
Panasonic |
THERM PAD 158MMX112MM GRAY |
8 |
|
|
|
t-Global Technology |
THERM PAD 16MMX16MM RED |
40 |
|
|
|
3M |
THERMAL COND 220MMx220MM 1=1SHT |
0 |
|
|
|
t-Global Technology |
THERMAL PAD 385X285MM DARK GREY |
10 |
|
|
|
3G Shielding Specialties |
THERMAL INTERFACE MATERIAL |
20 |
|
|
|
SUPERTHERMAL-A072-10-02-1500-1500 Aavid |
PAD SUPER A072 1MM 150X150MM |
0 |
|
|
|
t-Global Technology |
THERM PAD 640MMX320MM HENNA |
3 |
|
|
|
t-Global Technology |
THERM PAD 45.21MMX31.75MM W/ADH |
0 |
|
|
|
Parker Chomerics |
CHO-THERM T500 TO-220 0.010" ADH |
176 |
|
|
|
t-Global Technology |
THERM PAD A4500 20X20X3MM |
14 |
|
|
|
Panasonic |
THERM PAD 98X98X0.35MM GRAY |
10 |
|
|
|
t-Global Technology |
NON-SILICONE THERMAL PAD 150X150 |
0 |
|
|
|
t-Global Technology |
THERM PAD 150MMX150MM GRAY |
438 |
|
|
|
Laird - Performance Materials |
THERM PAD 228.6MMX228.6MM PINK |
10 |
|
|
|
t-Global Technology |
THERM PAD A4500 5X5X5MM |
650 |
|
Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.
| Type | Functional Features | Application Examples |
|---|---|---|
| Silicone-Based Pads | High flexibility, low compression force, dielectric insulation | Smartphones, laptops, LED lighting |
| Non-Silicone Pads | Lower cost, reduced silicone oil migration | Power supplies, industrial controls |
| Phase Change Materials (PCM) | Softening at operational temperatures for better contact | CPUs, GPUs, servers |
| Metal-Backed Pads | Aluminum/copper reinforcement for structural support | EV battery packs, high-power lasers |
| Graphite Sheets | Ultra-thin, anisotropic heat spreading | 5G base stations, wearable devices |
Typical thermal pads consist of:
| Parameter | Importance |
|---|---|
| Thermal Conductivity (W/m K) | Measures heat transfer efficiency (ASTM D5470) |
| Thickness (mm) | Impacts contact resistance and compression force |
| Operating Temperature Range ( C) | Determines material stability under thermal stress |
| Hardness (Shore 00) | Affects conformability to surfaces |
| Adhesion Strength (N/mm ) | Critical for mechanical fixation |
| Electrical Insulation (kV/mm) | Essential for high-voltage applications |
Major industries include:
| Manufacturer | Representative Product | Key Specification |
|---|---|---|
| Laird Performance Materials | THERM-A-GAP GEL 15 | 15 W/m K, 0.5mm thickness |
| Bergquist (Henkel) | Gap Pad 1500S | Silicone-free, 8.0 W/m K |
| 3M | 5595 PCM | Phase change at 55 C, 12 W/m K |
| Fujipoly | SARCON Matrix MG | Metal-gel hybrid, 20 W/m K |
| Momentive | TSE 3045 | Graphite sheet, 400 W/m K (in-plane) |
Key considerations:
Emerging trends include: