Thermal - Liquid Cooling, Heating

Image Part Number Description / PDF Quantity Rfq
120458

120458

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

23

180-11-24C

180-11-24C

Wakefield-Vette

COLD PLATE HEAT SINK 0.02C/W

0

120459

120459

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

10

120959

120959

Wakefield-Vette

COLD PLATE HEAT SINK BURIED

5

180-11-12C

180-11-12C

Wakefield-Vette

COLD PLATE HEAT SINK 0.041C/W

16

120961

120961

Wakefield-Vette

COLD PLATE HEAT SINK BURIED

1

180-12-6C

180-12-6C

Wakefield-Vette

COLD PLATE HEAT SINK 0.038C/W

22

HPLC-10

HPLC-10

Wakefield-Vette

RECIRC CHILLER 115VAC 1700W

3

120456

120456

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

23

120962

120962

Wakefield-Vette

COLD PLATE HEAT SINK BURIED

5

180-10-12C

180-10-12C

Wakefield-Vette

COLD PLATE HEAT SINK 0.041C/W

0

180-11-6C

180-11-6C

Wakefield-Vette

COLD PLATE HEAT SINK 0.084C/W

0

120963

120963

Wakefield-Vette

COLD PLATE HEAT SINK BURIED

76

180-12-12C

180-12-12C

Wakefield-Vette

COLD PLATE HEAT SINK 0.018C/W

0

120460

120460

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

0

120960

120960

Wakefield-Vette

COLD PLATE HEAT SINK BURIED

0

HPLC-20

HPLC-20

Wakefield-Vette

RECIRC CHILLER 220VAC 1900W

5

120455

120455

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

0

HPLC-RM-200

HPLC-RM-200

Wakefield-Vette

RACK MOUNT CHILLER 200W

2

120457

120457

Wakefield-Vette

COLD PLATE HEAT SINK EXPOSED

0

Thermal - Liquid Cooling, Heating

1. Overview

Liquid cooling and heating systems are thermal management solutions that use liquid media to transfer heat in electronic, industrial, and mechanical systems. These systems maintain optimal operating temperatures for components by absorbing, transporting, and dissipating heat (cooling) or providing controlled thermal energy (heating). Their importance has grown with increasing power densities in data centers, electric vehicles, and high-performance computing, where traditional air cooling reaches limitations.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Direct-to-Chip Liquid CoolingTargets specific heat sources with cold plates or microchannelsCPU/GPU cooling in servers
Immersion CoolingSubmerges components in dielectric coolantDatacenter server racks
Chiller-Based SystemsUses refrigeration cycles with heat exchangersIndustrial machinery cooling
Heating CirculatorsProvides precise temperature control through liquid heatingMedical device thermal calibration

3. Structure and Components

Typical systems include: - Heat exchangers (cold plates, radiators) - Circulation pumps for liquid movement - Fluid reservoirs with level/pressure monitoring - Thermal interface materials (TIMs) - Temperature sensors and control valves - Corrosion-resistant tubing with quick-disconnect fittings Modern designs often integrate smart controllers for dynamic performance adjustment.

4. Key Technical Specifications

ParameterImportanceTypical Range
Cooling CapacityDetermines maximum heat load removal1-150 kW
Temperature StabilityCritical for sensitive electronics 0.5 C
Flow RateAffects thermal response speed1-20 L/min
Pressure DropImpacts pump selection and efficiency0.5-5 bar
Material CompatibilityPrevents corrosion and leaksCopper, stainless steel, plastics

5. Application Areas

Key industries include: - Data Centers: Liquid-cooled server racks - Automotive: EV battery thermal management - Industrial: Laser cutting machine cooling - Healthcare: MRI scanner temperature control - Renewables: Solar inverter cooling systems

6. Leading Manufacturers

ManufacturerRepresentative ProductUnique Features
AsetekRapid Rack CDUModular datacenter cooling
CoolIT SystemsDLC Direct-to-ChipSealed cold plate technology
DanfossORC TurbostackHigh-efficiency heat recovery
Parker HannifinThermal LoopSpacecraft thermal control

7. Selection Recommendations

Key considerations: - Heat load profile and peak thermal requirements - Space constraints (footprint and height limitations) - Fluid compatibility with existing systems - Maintenance accessibility and service intervals - Energy efficiency (PUE for data centers) - Redundancy requirements for critical systems - Total cost of ownership (TCO) over 5-10 years

8. Industry Trends

Emerging developments include: - Adoption of two-phase immersion cooling in hyperscale data centers - Integration of AI-driven thermal optimization algorithms - Development of nanofluids for enhanced heat transfer - Standardization of liquid cooling interfaces (e.g., OCP standards) - Increased use in EV charging stations (350kW+ fast chargers) - Growth of liquid cooling in 5G base stations and edge computing

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