Thermal - Adhesives, Epoxies, Greases, Pastes

Part Number	Description / PDF	Quantity
A16086-01 Laird - Performance Materials	TGREASE 980 0.5 KG	0
A17170-02 Laird - Performance Materials	TPUTTY 508	0
A16872-03 Laird - Performance Materials	TPUTTY 403 180CC CARTRIDGE	98
A17170-03 Laird - Performance Materials	TPUTTY 508 360CC EFD CARTRIDGE	0
A17251-03 Laird - Performance Materials	TPUTTY 607 360CC EFD CARTRIDGE	16
A17170-01 Laird - Performance Materials	TPUTTY 508	71
A14399-02 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 2500	0
A16241-02 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 2500	0
A16241-01 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 1500	0
A16412-01 Laird - Performance Materials	TPUTTY 506 75CC CARTRIDGE	0
A16872-04 Laird - Performance Materials	TPUTTY 403 360CC CARTRIDGE	18
A16241-03 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 880	0
A14399-01 Laird - Performance Materials	THERMAL GREASE 10CC TGREASE 2500	0
A15423-02 Laird - Performance Materials	THERMAL GREASE 10CC TGREASE 1500	0
A17170-10 Laird - Performance Materials	TPUTTY 508 600CC EFD CARTRIDGE	0
A16872-02 Laird - Performance Materials	TPUTTY 403 75CC CARTRIDGE	210
A17251-01 Laird - Performance Materials	TPUTTY 607 75CC EFD CARTRIDGE	0
A15423-03 Laird - Performance Materials	THERMAL GREASE 30CC TGREASE 1500	0
A17251-02 Laird - Performance Materials	TPUTTY 607 180CC EFD CARTRIDGE	0
A17170-04 Laird - Performance Materials	TPUTTY 508 CARTRIDGE	0

Thermal - Adhesives, Epoxies, Greases, Pastes

1. Overview

Thermal interface materials (TIMs) are specialized substances designed to enhance heat transfer between mating surfaces. These materials fill microscopic air gaps and reduce thermal resistance in electronic, mechanical, and industrial systems. With increasing power densities in modern devices, effective thermal management has become critical for reliability, performance, and longevity.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Thermal Adhesives	Permanently bond surfaces while conducting heat. Available in conductive/dielectric variants.	CPU heatsink bonding, LED module assembly
Epoxy Systems	Two-part compounds with high structural strength and thermal conductivity.	Power module encapsulation, motor controller assembly
Thermal Greases	Non-curing compounds with optimal gap-filling properties.	GPU cooling, automotive sensor mounting
Phase Change Materials	Temperature-activated compounds that optimize interface at operational temperatures.	Server processors, high-frequency amplifiers

3. Structure & Composition

Typical formulations include:

Base Materials: Silicones, epoxies, polyurethanes, or acrylates
Fillers: Aluminum oxide, boron nitride, silver, or graphene for conductivity
Additives: Rheology modifiers, adhesion promoters, and antioxidants

Material microstructure is engineered to balance thermal performance with mechanical compliance.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Thermal Conductivity	Primary measure of heat transfer efficiency	1-8 W/m K
Operating Temperature	Determines application environment suitability	-50 C to 200 C
Viscosity	Affects application method and gap coverage	500-500,000 cP
Dielectric Strength	Electrical insulation capability	5-30 kV/mm
Curing Time/Temperature	Production process compatibility	Room temp-150 C

5. Application Fields

Consumer Electronics: Mobile devices, gaming consoles
Automotive: EV battery packs, power electronics
Industrial: Power supplies, laser systems
LED Lighting: Heat spreader attachment
Aerospace: Avionics thermal management

6. Leading Manufacturers & Products

Manufacturer	Key Products	Specialty
3M	TC-2810 Adhesive	High-conductivity die attach
Dow	SYLGARD 8660	Low-outgassing space applications
Henkel	Berger TIM 880	Phase-change processor pads
Master Bond	EP42HT-2AO	Two-part conductive epoxy

7. Selection Guidelines

Key considerations:

Thermal requirements vs. operating conditions
Material compatibility with substrates
Production process integration (curing, dispensing)
Long-term stability under thermal cycling
Cost-performance tradeoff analysis

Case Study: A server manufacturer reduced CPU operating temperatures by 12 C by switching from standard grease to a phase-change material with optimized melt profile.

Industry Trends

Emerging developments include:

Nano-enhanced composites achieving >10 W/m K
UV-curable formulations for faster processing
Low-VOC water-based systems for environmental compliance
Smart materials with temperature-dependent conductivity
Increased demand from EV battery thermal management systems