Thermal - Accessories

Image Part Number Description / PDF Quantity Rfq
QB0505B25ESC7

QB0505B25ESC7

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

ATS-PP-09

ATS-PP-09

Advanced Thermal Solutions, Inc.

HEATSINK BRASS PUSH PIN 20MM

0

MGT190

MGT190

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 19X19

0

ATS-SG450-R0

ATS-SG450-R0

Advanced Thermal Solutions, Inc.

SUPERGRIP CLIP KIT 45X45MM

179

QB0603A25WYC7

QB0603A25WYC7

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

MGT450

MGT450

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 45X45

0

QB0302B20ESTD

QB0302B20ESTD

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

ATS-PPS-02

ATS-PPS-02

Advanced Thermal Solutions, Inc.

HEATSINK SS SPRING 3.66MM

11039

QB0302B20WYTB

QB0302B20WYTB

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

V21HK

V21HK

ASSMANN WSW Components

CLIP HEAT SINK ASST PKGS

47

MGT425

MGT425

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 42.5X42.5

0

ATS-PPS-20

ATS-PPS-20

Advanced Thermal Solutions, Inc.

HEATSINK MUSIC WR SPRING 4.32MM

0

ATS-SG325-R0

ATS-SG325-R0

Advanced Thermal Solutions, Inc.

SUPERGRIP CLIP KIT 32.5X32.5MM

0

L-NIPP-8-1/8

L-NIPP-8-1/8

Laird Thermal Systems

THERMOELECT MOD NIPPLE 8MM, 1/8

19

ATS-HK91-R0

ATS-HK91-R0

Advanced Thermal Solutions, Inc.

HEATSINK BRASS PIN AND SPRING

4480

QB0505B25ESTD

QB0505B25ESTD

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

QB0603B25WYS3

QB0603B25WYS3

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

V03HK

V03HK

ASSMANN WSW Components

HEATSINK CLIP TO-220/TO-3/SOT-32

0

4644

4644

Keystone Electronics Corp.

INSULATOR 10-3CASE 1.655X1.063"D

1500

MGT230

MGT230

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 23X23

12

Thermal - Accessories

1. Overview

Thermal accessories are critical components in thermal management systems, designed to dissipate heat and maintain optimal operating temperatures for electronic devices. These accessories include fans, heat sinks, thermal interface materials, and related components that ensure efficient heat transfer and system reliability. With increasing power densities in modern electronics, effective thermal management has become essential for performance, longevity, and safety across industries such as computing, telecommunications, and automotive.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
DC/AC FansActive cooling via airflow generation, variable speed controlPC cooling, server racks, industrial machinery
Heat SinksPassive heat dissipation through conductive materialsCPU/GPU cooling, power electronics, LED lighting
Thermal Pads/GreaseFill gaps between components and heat sinks for improved conductionMotherboards, automotive electronics, handheld devices
Heat PipesHigh-efficiency phase-change heat transferLaptops, aerospace systems, industrial lasers
Fan Ducts/ShroudsDirect airflow to specific componentsData center cooling, automotive radiators

3. Structure and Components

Typical thermal accessories combine mechanical and thermal engineering principles:

  • Fans: Motor-driven blades (plastic/metal), bearing systems (sleeve/ball), housing with mounting features
  • Heat Sinks: Base plate (aluminum/copper) with extended fins, surface treatments (anodization, plating)
  • Thermal Interface Materials: Silicone-based compounds, phase-change materials, or graphite sheets with controlled thickness
  • Heat Pipes: Sealed copper tubes with wick structures and working fluids (water, ammonia)

4. Key Technical Specifications

ParameterDescriptionImportance
Thermal Resistance ( C/W)Material's ability to conduct heatDetermines cooling efficiency
Airflow (CFM)Volumetric air movement capacityImpacts active cooling performance
Noise Level (dBA)Acoustic emissions during operationCritical for user experience
MTBF (hours)Mean Time Between FailuresIndicates product reliability
Dimensions (mm)Physical size constraintsKey for system integration

5. Application Fields

  • Consumer Electronics: Gaming consoles, laptops, smartphones
  • Industrial: CNC machines, power inverters, robotics
  • Telecom: 5G base stations, network switches, optical transceivers
  • Automotive: EV battery cooling, onboard chargers, radar systems
  • Aerospace: Avionics cooling, satellite thermal control

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Delta ElectronicsAFB1212SH4000 RPM industrial fan with IP52 rating
Cooler MasterHyper 212 RGBTower heat sink with multiple heat pipes
Aavid (TE Connectivity)Thermal Gap Pad 15001.5W/mK conductivity, 0.5mm thickness
NoctuaNH-U12S ReduxLow-noise PC CPU cooler

7. Selection Recommendations

Key considerations include:

  • Thermal requirements (power dissipation, operating temperature range)
  • Environmental factors (dust, humidity, vibration)
  • Space constraints and mounting options
  • Noise limitations for end-user applications
  • Cost vs. performance trade-offs
  • Reliability needs (e.g., industrial vs. consumer use)

8. Industry Trends

Emerging developments include:

  • Miniaturization for 5G and IoT devices
  • Smart thermal systems with IoT-enabled sensors
  • Advanced materials (graphene, vapor chambers)
  • Energy-efficient fans with BLDC motors
  • AI-driven thermal management algorithms
  • Increased adoption of liquid cooling in high-power applications
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