Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
G3R40MT12J GeneSiC Semiconductor	SIC MOSFET N-CH 75A TO263-7	212
G3R75MT12D GeneSiC Semiconductor	SIC MOSFET N-CH 41A TO247-3	529
G3R20MT12N GeneSiC Semiconductor	SIC MOSFET N-CH 105A SOT227	84
GA50JT12-247 GeneSiC Semiconductor	TRANS SJT 1200V 100A TO247AB	6
GA08JT17-247 GeneSiC Semiconductor	TRANS SJT 1700V 8A TO247AB	0
GA10SICP12-263 GeneSiC Semiconductor	TRANS SJT 1200V 25A D2PAK	0
GA10JT12-263 GeneSiC Semiconductor	TRANS SJT 1200V 25A	170
G3R160MT12J GeneSiC Semiconductor	SIC MOSFET N-CH 22A TO263-7	438
G3R160MT17J GeneSiC Semiconductor	SIC MOSFET N-CH 22A TO263-7	460
G2R1000MT33J GeneSiC Semiconductor	SIC MOSFET N-CH 4A TO263-7	1130
G3R30MT12J GeneSiC Semiconductor	SIC MOSFET N-CH 96A TO263-7	0
G3R450MT17J GeneSiC Semiconductor	SIC MOSFET N-CH 9A TO263-7	998
GA05JT03-46 GeneSiC Semiconductor	TRANS SJT 300V 9A TO46	0
G2R1000MT17D GeneSiC Semiconductor	SIC MOSFET N-CH 4A TO247-3	0
GA20JT12-263 GeneSiC Semiconductor	TRANS SJT 1200V 45A D2PAK	134
GA05JT12-263 GeneSiC Semiconductor	TRANS SJT 1200V 15A D2PAK	0
G3R40MT12D GeneSiC Semiconductor	SIC MOSFET N-CH 71A TO247-3	281
G3R450MT17D GeneSiC Semiconductor	SIC MOSFET N-CH 9A TO247-3	524
G3R75MT12J GeneSiC Semiconductor	SIC MOSFET N-CH 42A TO263-7	386
G3R160MT17D GeneSiC Semiconductor	SIC MOSFET N-CH 21A TO247-3	580

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS