Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SQ9407EY-T1_GE3

SQ9407EY-T1_GE3

Vishay / Siliconix

MOSFET P-CHANNEL 60V 4.6A 8SO

0

IRFP360PBF

IRFP360PBF

Vishay / Siliconix

MOSFET N-CH 400V 23A TO247-3

760

SUM110N04-2M1P-E3

SUM110N04-2M1P-E3

Vishay / Siliconix

MOSFET N-CH 40V 29A/110A TO263

0

IRF620STRLPBF

IRF620STRLPBF

Vishay / Siliconix

MOSFET N-CH 200V 5.2A D2PAK

174

SIHF12N50C-E3

SIHF12N50C-E3

Vishay / Siliconix

MOSFET N-CH 500V 12A TO220

1000

SQ4050EY-T1_GE3

SQ4050EY-T1_GE3

Vishay / Siliconix

MOSFET N-CHANNEL 40V 19A 8SOIC

2281

SIJA52ADP-T1-GE3

SIJA52ADP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 41.6A/131A PPAK

5962

SIHP21N60EF-GE3

SIHP21N60EF-GE3

Vishay / Siliconix

MOSFET N-CH 600V 21A TO220AB

600

IRF614STRRPBF

IRF614STRRPBF

Vishay / Siliconix

MOSFET N-CH 250V 2.7A D2PAK

0

SIHA25N50E-E3

SIHA25N50E-E3

Vishay / Siliconix

MOSFET N-CH 500V 26A TO220

1192

SIHH100N60E-T1-GE3

SIHH100N60E-T1-GE3

Vishay / Siliconix

MOSFET N-CH 600V 28A PPAK 8 X 8

0

SI4368DY-T1-GE3

SI4368DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 17A 8SO

0

SQJ422EP-T1_GE3

SQJ422EP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 40V 74A PPAK SO-8

11807

IRL520PBF-BE3

IRL520PBF-BE3

Vishay / Siliconix

MOSFET N-CH 100V 9.2A TO220AB

1000

IRLZ34SPBF

IRLZ34SPBF

Vishay / Siliconix

MOSFET N-CH 60V 30A TO263

80

IRFR9310TRLPBF

IRFR9310TRLPBF

Vishay / Siliconix

MOSFET P-CH 400V 1.8A DPAK

1666

IRFD214

IRFD214

Vishay / Siliconix

MOSFET N-CH 250V 450MA 4DIP

0

SI3469DV-T1-GE3

SI3469DV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 5A 6TSOP

2764

SI3442BDV-T1-GE3

SI3442BDV-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 3A 6TSOP

0

IRF830ASPBF

IRF830ASPBF

Vishay / Siliconix

MOSFET N-CH 500V 5A D2PAK

4

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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