Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TPCC8002-H(TE12LQM

TPCC8002-H(TE12LQM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 22A 8TSON

0

SSM3K35MFV,L3F

SSM3K35MFV,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 180MA VESM

0

TK50E06K3(S1SS-Q)

TK50E06K3(S1SS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 50A TO220-3

0

TK12P60W,RVQ

TK12P60W,RVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 11.5A DPAK

0

2SK2845(TE16L1,Q)

2SK2845(TE16L1,Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 900V 1A DP

0

2SK2963(TE12L,F)

2SK2963(TE12L,F)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 1A PW-MINI

0

2SJ681(Q)

2SJ681(Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 5A PW-MOLD2

0

HN4K03JUTE85LF

HN4K03JUTE85LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 100MA USV

0

TPCC8001-H(TE12LQM

TPCC8001-H(TE12LQM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 22A 8TSON

0

2SK2989(T6CANO,F,M

2SK2989(T6CANO,F,M

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH TO92MOD

0

2SK1829TE85LF

2SK1829TE85LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 50MA SC70

0

2SK2266(TE24R,Q)

2SK2266(TE24R,Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 45A TO220SM

0

2SK3670(T6CANO,A,F

2SK3670(T6CANO,A,F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH TO92MOD

0

TK12P60W,RVQ(S

TK12P60W,RVQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 11.5A DPAK

0

TK13A65U(STA4,Q,M)

TK13A65U(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13A TO220SIS

0

SSM3K35MFV(TPL3)

SSM3K35MFV(TPL3)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 180MA VESM

0

SSM6J409TU(TE85L,F

SSM6J409TU(TE85L,F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 9.5A UF6

0

2SK2866(F)

2SK2866(F)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 10A TO220AB

0

TPC8033-H(TE12LQM)

TPC8033-H(TE12LQM)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 17A 8SOP

0

TPC6104(TE85L,F,M)

TPC6104(TE85L,F,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 5.5A VS-6

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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