Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - RF

Image	Part Number	Description / PDF	Quantity	Rfq
	BF245A_D27Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 6.5MA TO92	0
	BF245B_J35Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 15MA TO92	0
	J310RLRPG Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 60MA TO92	0
	2N5953_J35Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 5MA TO92	0
	MMBF4416LT1G Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 15MA SOT23	0
	BF256B_J35Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 13MA TO92	0
	2N5486RLRP Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 30MA TO92	0
	BF245B_D74Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 15MA TO92	0
	BF245B_D75Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 15MA TO92	0
	2N5486RLRPG Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 30MA TO92	0
	BF256C Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 18MA TO92	0
	BF245B Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 100MA TO92	0
	J310ZL1G Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 60MA TO92	0
	BF245C_J35Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 25MA TO92	0
	J212 Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 40MA TO92	0
	J210_D27Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 15MA TO92	0
	BF256C_J35Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 18MA TO92	0
	J309_D74Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 30MA TO92	0
	2N5951 Sanyo Semiconductor/ON Semiconductor	JFET N-CH 30V 13MA TO92	0
	2N5484_D26Z Sanyo Semiconductor/ON Semiconductor	JFET N-CH 25V 5MA TO92	0

Transistors - FETs, MOSFETs - RF

1. Overview

RF FETs and MOSFETs are critical semiconductor devices designed for high-frequency signal amplification and switching in radio frequency (RF) applications. These transistors operate efficiently in microwave and RF circuits, enabling wireless communication, radar systems, and broadcasting equipment. Their ability to handle high frequencies (typically above 1 MHz) with minimal noise and distortion makes them indispensable in modern telecommunications infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Junction FET (JFET)	Voltage-controlled device with low noise and high input impedance	Low-noise amplifiers in RF receivers
MESFET	Metal-Semiconductor FET with GaAs substrate for high-speed operation	Satellite communication systems
HEMT/PHEMT	High-electron-mobility transistor with pseudomorphic structures	5G base stations, microwave amplifiers
LDMOS	Lateral Diffused MOSFET with high power density and thermal stability	Cellular base station amplifiers
GaN HEMT	Gallium Nitride-based HEMT for ultra-high frequency/power	Radar systems, 5G mmWave

3. Structure and Composition

RF FETs typically feature a three-terminal structure (source, gate, drain) with a semiconductor channel (Si, GaAs, or GaN). The gate region uses Schottky contacts (MESFET) or insulated layers (MOSFET). Advanced devices like HEMTs employ heterojunctions between different semiconductor materials (e.g., AlGaN/GaN) to enhance electron mobility. Packaging includes ceramic or plastic enclosures with RF-compatible connectors to minimize parasitic capacitance and inductance.

4. Key Technical Specifications

Parameter	Description	Importance
Frequency Range	Operational bandwidth (e.g., 0.1-6 GHz)	Determines application suitability
Power Output (P1dB)	1dB compression point (e.g., 10-500W)	Measures linearity and saturation
Gain (S21)	Signal amplification ratio (e.g., 10-30 dB)	System sensitivity indicator
Efficiency (PAE)	Power-added efficiency (e.g., 40-75%)	Energy consumption metric
Input/Output VSWR	Voltage Standing Wave Ratio (e.g., <2:1)	Mismatch loss assessment

5. Application Fields

Telecommunications: 5G/4G base stations, small cells, fiber-optic networks
Defense: Radar systems, electronic warfare, UAV communication
Broadcasting: FM/TV transmitters, satellite uplinks
Medical: MRI machines, RF ablation equipment
Industrial: Plasma generators, RFID readers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
NXP Semiconductors	MRF1K50GN	50W GaN HEMT, 1.8-2.7GHz, 70% PAE
Wolfspeed (Cree)	CGH4G090400F	400W GaN HEMT, 900MHz, 10:1 VSWR ruggedness
Infineon	BLS14H10LS-250	250W LDMOS, 1.8-2.2GHz, 14dB gain
MACOM	NPT1007	SiGe HBT, 7GHz, 18dB gain for 5G

7. Selection Recommendations

Match operating frequency to device transition frequency (f_T)
Verify power handling with derating curves under working temperatures
Assess package thermal resistance (R_th) for longevity
Compare S-parameters for impedance matching requirements
Consider ESD protection and ruggedness for field conditions

8. Industry Trends

Key trends include: - Wide bandgap materials (GaN/SiC) enabling higher efficiency (>80%) at mmWave frequencies - 3D packaging for reduced parasitics in 5G massive MIMO systems - Integrated RF frontend modules (FEM) with on-chip matching networks - AI-driven design optimization for complex impedance matching - Growing adoption of GaN-on-diamond substrates for thermal management