Transistors - FETs, MOSFETs - RF

Image Part Number Description / PDF Quantity Rfq
LET9045F

LET9045F

STMicroelectronics

FET RF LDMOS 80V 9A M-250

0

PD84008L-E

PD84008L-E

STMicroelectronics

FET RF 25V 870MHZ

491

PD84006L-E

PD84006L-E

STMicroelectronics

FET RF 25V 870MHZ

3548

PD85035TR-E

PD85035TR-E

STMicroelectronics

TRANS RF N-CH FET POWERSO-10RF

0

SD57045

SD57045

STMicroelectronics

FET RF 65V 945MHZ M243

4

PD54008S-E

PD54008S-E

STMicroelectronics

FET RF 25V 500MHZ PWRSO-10

0

STAC4932F

STAC4932F

STMicroelectronics

TRANS RF PWR N-CH STAC244F

0

PD85025S-E

PD85025S-E

STMicroelectronics

FET RF 40V 870MHZ

0

SD2931-10W

SD2931-10W

STMicroelectronics

IC TRANS RF HF/VHF/UHF M174

143

PD54003-E

PD54003-E

STMicroelectronics

FET RF 25V 500MHZ PWRSO10

0

STAC2942FW

STAC2942FW

STMicroelectronics

TRANS RF PWR N-CH 350W STAC244B

0

SD2933W

SD2933W

STMicroelectronics

IC TRANS RF HF/VHF/UHF

0

SD57060-10

SD57060-10

STMicroelectronics

FET RF 65V 945MHZ M243

0

PD85025-E

PD85025-E

STMicroelectronics

FET RF 40V 870MHZ

0

PD55015TR-E

PD55015TR-E

STMicroelectronics

TRANS RF N-CH FET POWERSO-10RF

444

PD55008S-E

PD55008S-E

STMicroelectronics

FET RF 40V 500MHZ PWRSO10

65

SD2933-03W

SD2933-03W

STMicroelectronics

TRANS RF N-CH HF/VHF/UHF M177

0

PD57030-E

PD57030-E

STMicroelectronics

FET RF 65V 945MHZ PWRSO10

769

SD57045-01

SD57045-01

STMicroelectronics

FET RF 65V 945MHZ M250

0

STAC3932B

STAC3932B

STMicroelectronics

TRANS RF PWR N-CH 580W STAC244B

0

Transistors - FETs, MOSFETs - RF

1. Overview

RF FETs and MOSFETs are critical semiconductor devices designed for high-frequency signal amplification and switching in radio frequency (RF) applications. These transistors operate efficiently in microwave and RF circuits, enabling wireless communication, radar systems, and broadcasting equipment. Their ability to handle high frequencies (typically above 1 MHz) with minimal noise and distortion makes them indispensable in modern telecommunications infrastructure.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Junction FET (JFET)Voltage-controlled device with low noise and high input impedanceLow-noise amplifiers in RF receivers
MESFETMetal-Semiconductor FET with GaAs substrate for high-speed operationSatellite communication systems
HEMT/PHEMTHigh-electron-mobility transistor with pseudomorphic structures5G base stations, microwave amplifiers
LDMOSLateral Diffused MOSFET with high power density and thermal stabilityCellular base station amplifiers
GaN HEMTGallium Nitride-based HEMT for ultra-high frequency/powerRadar systems, 5G mmWave

3. Structure and Composition

RF FETs typically feature a three-terminal structure (source, gate, drain) with a semiconductor channel (Si, GaAs, or GaN). The gate region uses Schottky contacts (MESFET) or insulated layers (MOSFET). Advanced devices like HEMTs employ heterojunctions between different semiconductor materials (e.g., AlGaN/GaN) to enhance electron mobility. Packaging includes ceramic or plastic enclosures with RF-compatible connectors to minimize parasitic capacitance and inductance.

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 0.1-6 GHz)Determines application suitability
Power Output (P1dB)1dB compression point (e.g., 10-500W)Measures linearity and saturation
Gain (S21)Signal amplification ratio (e.g., 10-30 dB)System sensitivity indicator
Efficiency (PAE)Power-added efficiency (e.g., 40-75%)Energy consumption metric
Input/Output VSWRVoltage Standing Wave Ratio (e.g., <2:1)Mismatch loss assessment

5. Application Fields

  • Telecommunications: 5G/4G base stations, small cells, fiber-optic networks
  • Defense: Radar systems, electronic warfare, UAV communication
  • Broadcasting: FM/TV transmitters, satellite uplinks
  • Medical: MRI machines, RF ablation equipment
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
NXP SemiconductorsMRF1K50GN50W GaN HEMT, 1.8-2.7GHz, 70% PAE
Wolfspeed (Cree)CGH4G090400F400W GaN HEMT, 900MHz, 10:1 VSWR ruggedness
InfineonBLS14H10LS-250250W LDMOS, 1.8-2.2GHz, 14dB gain
MACOMNPT1007SiGe HBT, 7GHz, 18dB gain for 5G

7. Selection Recommendations

  1. Match operating frequency to device transition frequency (fT)
  2. Verify power handling with derating curves under working temperatures
  3. Assess package thermal resistance (Rth) for longevity
  4. Compare S-parameters for impedance matching requirements
  5. Consider ESD protection and ruggedness for field conditions

8. Industry Trends

Key trends include: - Wide bandgap materials (GaN/SiC) enabling higher efficiency (>80%) at mmWave frequencies - 3D packaging for reduced parasitics in 5G massive MIMO systems - Integrated RF frontend modules (FEM) with on-chip matching networks - AI-driven design optimization for complex impedance matching - Growing adoption of GaN-on-diamond substrates for thermal management

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