Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
HS2222A

HS2222A

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NPN TRANSISTOR

0

JANTX2N5686

JANTX2N5686

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TRANS NPN 80V 50A TO-39

0

JAN2N2484UB

JAN2N2484UB

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TRANS NPN 60V 0.05A

0

JANSF2N2222AUA

JANSF2N2222AUA

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NPN TRANSISTOR

0

JAN2N4261UB

JAN2N4261UB

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TRANS PNP 15V 0.03A

0

JANTX2N5680

JANTX2N5680

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PNP TRANSISTOR

0

JAN2N5663

JAN2N5663

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TRANS NPN 300V 2A TO-5

0

JANSR2N3501U4

JANSR2N3501U4

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BJTS

0

JAN2N3418

JAN2N3418

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TRANS NPN 60V 3A

0

JANS2N3439

JANS2N3439

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TRANS NPN 350V 1A

0

JAN2N2369AUB

JAN2N2369AUB

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TRANS NPN 15V

0

JANTX2N6351

JANTX2N6351

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TRANS NPN DARL 150V 5A TO-33

0

JAN2N3055

JAN2N3055

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TRANS NPN 70V 15A TO-3

0

JAN2N3996

JAN2N3996

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TRANS NPN 80V 10A TO111

0

JAN2N3499L

JAN2N3499L

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TRANS NPN 100V 0.5A TO5

0

2N3420

2N3420

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NPN POWER SILICON TRANSISTORS

0

JANTX2N2906AUB

JANTX2N2906AUB

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TRANS PNP 60V 0.6A

0

JANS2N2222AUBC

JANS2N2222AUBC

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NPN TRANSISTOR

0

2N6678

2N6678

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PNP TRANSISTOR

0

2N1711S

2N1711S

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NPN TRANSISTOR

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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