Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
BLT80,115

BLT80,115

NXP Semiconductors

RF TRANS NPN 10V 900MHZ SOT223

0

BFG135,115

BFG135,115

NXP Semiconductors

RF TRANS NPN 15V 7GHZ SOT223

0

BFG67,215

BFG67,215

NXP Semiconductors

RF TRANS NPN 10V 8GHZ SOT143B

0

BFG403W,115

BFG403W,115

NXP Semiconductors

RF TRANS NPN 4.5V 17GHZ CMPAK-4

0

BFU725F,115

BFU725F,115

NXP Semiconductors

RF TRANS NPN 2.8V 70GHZ 4DFP

0

BF240,112

BF240,112

NXP Semiconductors

RF TRANS NPN 40V 150MHZ TO92-3

0

BLS3135-20,114

BLS3135-20,114

NXP Semiconductors

RF TRANS NPN 75V 3.5GHZ CDFM2

0

BFG540/XR,215

BFG540/XR,215

NXP Semiconductors

RF TRANS NPN 15V 9GHZ SOT143R

0

BFS17W,115

BFS17W,115

NXP Semiconductors

RF TRANS NPN 15V 1.6GHZ SOT323-3

0

BFG424W,115

BFG424W,115

NXP Semiconductors

RF TRANS NPN 4.5V 25GHZ CMPAK-4

0

BFT25A,215

BFT25A,215

NXP Semiconductors

RF TRANS NPN 5V 5GHZ TO236AB

0

BFQ67W,135

BFQ67W,135

NXP Semiconductors

RF TRANS NPN 10V 8GHZ SOT323-3

0

PBR951,215

PBR951,215

NXP Semiconductors

RF TRANS NPN 10V 8GHZ TO236AB

0

BFM520,115

BFM520,115

NXP Semiconductors

RF TRANS 2 NPN 8V 9GHZ 6TSSOP

0

BLS3135-65,114

BLS3135-65,114

NXP Semiconductors

RF TRANS NPN 75V 3.5GHZ CDFM2

0

BLS3135-10,114

BLS3135-10,114

NXP Semiconductors

RF TRANS NPN 75V 3.5GHZ CDFM2

0

BLT70,115

BLT70,115

NXP Semiconductors

RF TRANS NPN 8V 900MHZ SOT223

0

BFG25AW/X,115

BFG25AW/X,115

NXP Semiconductors

RF TRANS NPN 5V 5GHZ 4SO

0

BFQ540,115

BFQ540,115

NXP Semiconductors

RF TRANS NPN 15V 9GHZ SOT89-3

0

BFG520/X,235

BFG520/X,235

NXP Semiconductors

RF TRANS NPN 15V 9GHZ SOT143B

0

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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