Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
BFR93AR,215

BFR93AR,215

NXP Semiconductors

RF SMALL SIGNAL TRANSISTOR

0

BFU550XRVL

BFU550XRVL

NXP Semiconductors

RF TRANS NPN 12V 11GHZ SOT143R

0

BFU520AVL

BFU520AVL

NXP Semiconductors

RF TRANS NPN 12V 10GHZ TO236AB

0

BFU730F,115

BFU730F,115

NXP Semiconductors

RF TRANS NPN 2.8V 55GHZ 4DFP

35017

BFU520AR

BFU520AR

NXP Semiconductors

RF TRANS NPN 12V 10GHZ TO236AB

2232

BFR93A215

BFR93A215

NXP Semiconductors

RF BIPOLAR TRANSISTOR

12288

BFU550AR

BFU550AR

NXP Semiconductors

RF TRANS NPN 12V 11GHZ TO236AB

2029

BFU550XAR

BFU550XAR

NXP Semiconductors

RF TRANS NPN 12V 11GHZ SOT143B

16535

BFG505,215

BFG505,215

NXP Semiconductors

BFG505 - UPN 9 GHZ WIDEBAND TRAN

0

BFU520235

BFU520235

NXP Semiconductors

NPN RF TRANSISTOR

0

BFU550AVL

BFU550AVL

NXP Semiconductors

RF TRANS NPN 12V 11GHZ TO236AB

0

BFU520W135

BFU520W135

NXP Semiconductors

NPN RF TRANSISTOR

0

BFU668F,115

BFU668F,115

NXP Semiconductors

TRANSISTOR NPN SOT343F

57

BFU520X215

BFU520X215

NXP Semiconductors

NPN RF TRANSISTOR

9000

BFU520XRR

BFU520XRR

NXP Semiconductors

RF TRANS NPN 12V 10.5GHZ SOT143R

4366

BFU550WX

BFU550WX

NXP Semiconductors

RF TRANS NPN 12V 11GHZ SOT323-3

11323

BFU550WF

BFU550WF

NXP Semiconductors

RF TRANS NPN 12V 11GHZ SOT323-3

9862

PRF947,115

PRF947,115

NXP Semiconductors

TRANSISTOR NPN 10V 8.5GHZ SOT323

14140

BFG410W,115

BFG410W,115

NXP Semiconductors

TRANS NPN 4.5V 22GHZ SOT343R

9140

BFR106,215

BFR106,215

NXP Semiconductors

RF SMALL SIGNAL TRANSISTOR

2520

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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