Transistors - Bipolar (BJT) - Arrays, Pre-Biased

Part Number	Description / PDF	Quantity
NSBA114YDP6T5G Sanyo Semiconductor/ON Semiconductor	TRANS PREBIAS 2PNP 50V SOT963	0
PEMB4,115 NXP Semiconductors	NOW NEXPERIA PEMB4 - SMALL SIGNA	56821
PEMB3,115 Nexperia	TRANS PREBIAS 2PNP 50V SOT666	0
IMD23T108 ROHM Semiconductor	TRANS PREBIAS NPN/PNP 50V SC74	0
FMG2AT148 ROHM Semiconductor	TRANS 2NPN PREBIAS 0.3W SMT5	44
RN4988(TE85L,F) Toshiba Electronic Devices and Storage Corporation	NPN + PNP BRT, Q1BSR=22KΩ, Q1BER	3000
NSVUMC3NT1G Sanyo Semiconductor/ON Semiconductor	TRANS NPN/PNP PREBIAS 0.15W SC88	69000
NHUMD9F Nexperia	NHUMD9/SOT363/SC-88	9996
PUMB14,115 NXP Semiconductors	NOW NEXPERIA PUMB14 - SMALL SIGN	75000
RN1709JE(TE85L,F) Toshiba Electronic Devices and Storage Corporation	NPN X 2 BRT, Q1BSR=47KΩ, Q1BER=2	3873
RN1711JE(TE85L,F) Toshiba Electronic Devices and Storage Corporation	TRANSISTOR NPN X2 BRT Q1BSR10KOH	8000
NSTB60BDW1T1	SMALL SIGNAL BIPOLAR TRANSISTOR	11970
NSBA114TDXV6T5	SMALL SIGNAL BIPOLAR TRANSISTOR	15999
PEMD14,115 Nexperia	TRANS PREBIAS NPN/PNP 50V SOT666	0
RN1703,LF Toshiba Electronic Devices and Storage Corporation	NPNX2 BRT Q1BSR22KOHM Q1BER22KOH	6000
NSVB143ZPDXV6T1G Sanyo Semiconductor/ON Semiconductor	TRANS PREBIAS NPN/PNP 50V SOT563	0
NHUMH1X Nexperia	NHUMH1/SOT363/SC-88	3000
ADA114EUQ-7 Zetex Semiconductors (Diodes Inc.)	PREBIAS TRANSISTOR SOT363	57000
DCX124EU-7-F Zetex Semiconductors (Diodes Inc.)	TRANS NPN/PNP PREBIAS SOT363	0
MUN5334DW1T1G Sanyo Semiconductor/ON Semiconductor	TRANS PREBIAS NPN/PNP SOT363	219000

Transistors - Bipolar (BJT) - Arrays, Pre-Biased

1. Overview

Pre-biased Bipolar Junction Transistor (BJT) arrays integrate multiple transistors with built-in bias resistors in a single package. These devices simplify circuit design by eliminating external resistor networks, reducing PCB footprint, and ensuring stable operation. They play a critical role in modern electronics for signal amplification, switching, and logic functions in applications ranging from consumer electronics to industrial automation.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
NPN Arrays	Common-emitter configuration with integrated base resistors for switching	Digital logic circuits, relay drivers
PNP Arrays	Negative voltage switching with matched resistor ratios	Motor control, battery management
Complementary Pairs	Matched NPN/PNP transistors for push-pull amplifiers	Audio amplifiers, power supplies
Darlington Arrays	High current gain ( ) through cascaded transistor pairs	High-current switching in automotive systems

3. Structure and Composition

Pre-biased BJT arrays typically use silicon epitaxial planar technology. The structure includes:

Dielectric Isolation: Silicon dioxide layers separate individual transistors
Integrated Resistors: Laser-trimmed thin-film resistors set bias points
Package: Standard SOT-26, SOT-89, or SOP-8 plastic packages
Protection Diodes: Built-in ESD protection networks

4. Key Technical Specifications

Parameter	Description	Importance
hFE (Current Gain)	Ratio of collector to base current	Determines amplification capability
VCEO (Max Voltage)	Max voltage between collector and emitter	Limits operating voltage range
Ic (Max Current)	Maximum collector current rating	Defines power handling capability
fT (Transition Frequency)	Frequency at which gain drops to unity	Indicates high-frequency performance
VCE(sat)	Collector-emitter saturation voltage	Affects power efficiency

5. Application Areas

Main industries and typical equipment:

Consumer Electronics: Mobile phones, LED displays, home appliances
Industrial Control: PLCs, motor drivers, sensor interfaces
Automotive: ECU systems, LED lighting drivers, infotainment systems
Telecom: Base station power amplifiers, optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
ON Semiconductor	MBT3946DW1T5G	100mA Ic, 40V VCEO, 100MHz fT
Nexperia	PMBT2369EAR	Dual NPN array, 300mA total current
STMicroelectronics	SMUN2232T	PNP+Schottky diode array, 100mA
Infineon	IPAR10L3M06	Automotive-grade Darlington array

7. Selection Recommendations

Key considerations during component selection:

Match VCEO/Ic ratings with circuit requirements
Select appropriate hFE for desired gain
Consider thermal resistance for power applications
Evaluate package size vs. current density
Verify temperature stability (-40 C to +150 C)

8. Industry Trends

Future development directions include:

Higher integration levels (e.g., 8-transistor arrays in TSSOP)
Wide bandgap materials (SiC/GaN BJT hybrids)
Micron-scale packaging (0.4mm pitch QFN)
Smart power arrays with integrated protection circuits
Reduced parasitic capacitance for >5GHz RF applications