Thyristors - DIACs, SIDACs

Image Part Number Description / PDF Quantity Rfq
K2000GRP

K2000GRP

Wickmann / Littelfuse

SIDAC 190-215V 1A DO15

0

NTE6418

NTE6418

NTE Electronics, Inc.

D-SYDAC 104-118V

753

K2200G

K2200G

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K1300SRP

K1300SRP

Wickmann / Littelfuse

SIDAC 120-138V 1A DO214

0

K2000GHAP

K2000GHAP

Wickmann / Littelfuse

SIDAC 190-215V 1A DO15

0

K2000EH70RP3

K2000EH70RP3

Wickmann / Littelfuse

SIDAC 190-215V 1A TO92

0

K2000E70

K2000E70

Wickmann / Littelfuse

SIDAC 190-215V 1A TO92

0

MKP1V130RLG

MKP1V130RLG

Wickmann / Littelfuse

SIDAC, 140V MAX, DO-41

1414

K1500SRP

K1500SRP

Wickmann / Littelfuse

SIDAC 140-170V 1A DO214

5747

TMMDB3TG

TMMDB3TG

STMicroelectronics

DIAC 30-34V 2A MINIMELF

4724

K2402G

K2402G

Wickmann / Littelfuse

SIDAC 220-250V 1A DO15

0

K2000GURP

K2000GURP

Wickmann / Littelfuse

SIDAC 190-210V 1A UNI DO-15

0

MKP9V160RL

MKP9V160RL

DIAC

65000

K2500SRP

K2500SRP

Wickmann / Littelfuse

SIDAC 240-280V 1A DO214

10906

K2202GRP

K2202GRP

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K2000EH70

K2000EH70

Wickmann / Littelfuse

SIDAC 190-215V 1A TO92

0

K2500GH

K2500GH

Wickmann / Littelfuse

SIDAC 240-280V 1A DO15

0

K2202G

K2202G

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K2000SHRP

K2000SHRP

Wickmann / Littelfuse

SIDAC 190-215V 1A DO214

0

K1200E70

K1200E70

Wickmann / Littelfuse

SIDAC 110-125V 1A TO92

616

Thyristors - DIACs, SIDACs

1. Overview

DIACs (Diodes for Alternating Current) and SIDACs (Silicon Diodes for Alternating Current) are bidirectional trigger devices used primarily to control thyristor-based circuits. These three-layer semiconductor devices exhibit negative resistance characteristics and are critical in AC power control systems. They enable precise switching of high-voltage AC loads through their unique breakover voltage behavior, making them essential in lighting, motor control, and industrial automation applications.

2. Main Types and Functional Classification

Type Functionality Application Examples
DIAC Low-power bidirectional trigger diode with symmetrical breakover voltage TRIAC gate triggering in dimmer switches
SIDAC Higher current/voltage capability with precise voltage clamping Industrial motor speed controllers
Programmable DIAC Voltage-adjustable triggering through external resistors Customizable power control systems

3. Structure and Composition

DIACs/SIDACs typically consist of a four-layer (PNPN) silicon structure with two main terminals (A1/A2). The symmetrical doping profile creates a negative resistance region during reverse bias. Advanced devices incorporate:

  • Epitaxial silicon layers for precise voltage control
  • Passivation layers for voltage stability
  • Metallization patterns for thermal management
  • Plastic/ceramic packaging for environmental protection

4. Key Technical Specifications

Parameter Description Importance
Breakover Voltage (VBO) Voltage threshold for conduction (typically 20-32V) Determines triggering point
Trigger Current (IT) Minimum current to sustain conduction Impacts load compatibility
Holding Current (IH) Current level to maintain on-state Affects circuit stability
Peak Current (IPT) Maximum transient current capability Overload protection
dv/dt Voltage change rate immunity Prevents false triggering

5. Application Areas

Key industries and equipment:

  • Lighting: Smart dimming systems, LED drivers
  • Industrial: Conveyor belt controllers, heating systems
  • Consumer: Washing machine motor controls
  • Power Electronics: AC voltage regulators

Example: DIACs in phase-control dimmers trigger TRIACs at specific AC cycle points to adjust light intensity.

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
STMicroelectronics DB3 Standard DIAC with 32V VBO
ON Semiconductor SIDAC103 100V, 3A industrial SIDAC
Vishay TECC94 High surge current capability

7. Selection Guidelines

Key considerations:

  1. Match VBO to TRIAC gate requirements
  2. Verify current ratings with load characteristics
  3. Choose packaging based on thermal needs
  4. Consider dv/dt ratings for noisy environments
  5. Evaluate temperature stability for industrial applications

8. Industry Trends

Emerging developments:

  • Integration with wide-bandgap semiconductors (SiC/GaN)
  • Miniaturization for PCB space optimization
  • Improved dv/dt immunity for EV charging systems
  • Smart grid compatibility with IoT-enabled controllers

Market growth driven by energy-efficient lighting and industrial automation demands.

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