Power Driver Modules | Discrete Semiconductor Components

Part Number	Description / PDF	Quantity
PS219B4-AS Powerex, Inc.	MOD DIPIPM 15A 600V SUPER MINI	9
PSM05S93E5-A Powerex, Inc.	MOD IPM 6-PAC 5A 500V DIP	33
PS22A74 Powerex, Inc.	MOD IPM 1200V 15A LARGE DIP	19
PSM03S93E5-A Powerex, Inc.	MOD IPM 6-PAC 3A 500V DIP	35
PM50RL1A060 Powerex, Inc.	MOD IPM 7-PAC L1 50A 600V	2
PS22A72 Powerex, Inc.	MOD IPM 1200V 5A LARGE DIP	2
PS219B2-AS Powerex, Inc.	MOD DIPIPM 5A 600V SUPER MINI	1
PS22A76 Powerex, Inc.	MOD IPM 1200V 25A LARGE DIP	24
PS21965-4 Powerex, Inc.	MOD IPM 600V 20A SUPERMINIDIP	12
VLA536-01R Powerex, Inc.	BOARD INTERFACE NX-SERIES	39
VLA555-01R Powerex, Inc.	ACCESSORY - GATE DRIVER AND DC T	0
VLA539-01 Powerex, Inc.	ACCESSORY- GATE DRIVER	0
VLA555-02R Powerex, Inc.	ACCESSORY - GATE DRIVER AND DC T	0
PS21961-4 Powerex, Inc.	MOD IPM 600V 3A SUPERMINI DIP	0
PS11037 Powerex, Inc.	MOD IPM 3PHASE IGBT 600V 50A	0
PM600DV1A060 Powerex, Inc.	MOD IPM V1 DUAL 600A 600V	0
PS21765 Powerex, Inc.	MOD IPM 600V 20A MINI DIP	0
PM30CSJ060 Powerex, Inc.	MOD IPM 6PAC 600V 30A	0
PS22A73 Powerex, Inc.	MOD IPM 1200V 10A LARGE DIP	0
PSS10S92F6-AG Powerex, Inc.	MOD IPM 6-PAC 10A 600V DIP	0

Power Driver Modules | Discrete Semiconductor Components

1. Overview

Discrete Semiconductor Power Driver Modules are integrated electronic components designed to control and drive high-power semiconductor devices such as MOSFETs, IGBTs, and bipolar transistors. These modules act as intermediaries between low-power control circuits (e.g., microcontrollers) and high-power loads, enabling precise switching and power management. They are critical in modern power electronics systems, ensuring efficiency, reliability, and safety in applications ranging from industrial automation to renewable energy systems.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
MOSFET Driver Modules	High-speed switching, low on-resistance, suitable for DC-DC converters and motor drives	Electric vehicle (EV) battery management systems
IGBT Driver Modules	High-voltage/current handling, soft-switching capabilities	Industrial motor drives, traction inverters
Bipolar Transistor Drivers	High current gain, linear operation mode	Analog amplifiers, legacy power systems
Gate Driver ICs	Integrated logic-to-power signal conversion, galvanic isolation options	Switching power supplies, LED lighting systems

3. Structure and Composition

Typical modules consist of:

Die Attach: Silicon dies for MOSFET/IGBT chips bonded to a conductive substrate
Substrate: Aluminum oxide (Al O ) or silicon nitride (Si N ) for thermal/electrical insulation
Encapsulation: Molded epoxy resin or ceramic housing for environmental protection
Terminals: Copper/Aluminum leads or surface-mount pads for PCB integration
Thermal Interface: Phase-change materials or thermal pads for heatsink attachment

4. Key Technical Specifications

Parameter	Description
Max Voltage Rating (Vds/Vce)	50V 1700V, determines application suitability (e.g., 600V for EVs, 1700V for rail transport)
Peak Output Current (Ipeak)	5A 100A, impacts switching performance and thermal design
Power Dissipation (Pd)	1W 200W, defines cooling requirements
Operating Temperature	-40 C to +175 C, critical for automotive/industrial environments
Isolation Voltage	2.5kV 10kV, safety requirement for high-voltage systems
Short-Circuit Withstand	10 s 10ms, protects against fault conditions

5. Application Fields

Industrial: Servo motor drives, CNC machine tools, welding inverters
Automotive: On-board chargers (OBC), traction inverters, 48V mild hybrid systems
Renewables: Solar string inverters, wind turbine converters
Consumer: High-end kitchen appliances, robotic vacuum cleaners
Case Study: A 3.6kW industrial motor drive using Infineon's 1EDN75120B gate driver achieved 98.5% efficiency.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Infineon Technologies	1EDN75120B	1200V IGBT driver with DESAT protection, 40ns propagation delay
STMicroelectronics	STGP10CH60DF	600V/10A SiC MOSFET power module for fast charging stations
ON Semiconductor	NCP51820	High-frequency (200kHz) gate driver for LLC resonant converters
Texas Instruments	UCC21750	Isolated gate driver with integrated current sensing for EV inverters

7. Selection Recommendations

Key considerations include:

Match voltage/current ratings with system requirements (add 20% safety margin)
Choose packaging (TO-247, D2PAK, or surface-mount) based on thermal needs
Verify compliance with standards (e.g., AEC-Q101 for automotive)
Assess protection features (overcurrent, thermal shutdown)
Evaluate driver IC compatibility for gate charge requirements

8. Industry Trends

Future developments include:

Adoption of wide-bandgap (WBG) semiconductors (SiC/GaN) for higher efficiency
Integration of sensors and digital interfaces (smart power modules)
Advanced packaging techniques (double-sided cooling, silver sintering)
Increased demand for automotive applications (EVs, 48V systems)
Standardization of isolation requirements per IEC 61800-5-1