1. Overview

Zener diode arrays are discrete semiconductor devices integrating multiple Zener diodes in a single package. They leverage the Zener breakdown effect to provide precise voltage regulation, overvoltage protection, and reference voltage generation. These arrays are critical in modern electronics for ensuring circuit stability, protecting sensitive components from voltage spikes, and enabling compact PCB designs. Their importance spans industries like automotive, telecommunications, and industrial automation.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Unidirectional Zener Arrays	Single-direction voltage clamping	ESD protection in data lines
Bidirectional Zener Arrays	Double-sided voltage regulation	AC voltage stabilization circuits
Multi-Voltage Arrays	Multiple Zener diodes with different Vz	Power supply sequencing
Low-Leakage Arrays	Minimized reverse leakage current	Battery-powered devices

3. Structure and Composition

Zener arrays consist of silicon semiconductor substrates with precisely doped P-N junctions. The die structure includes:

• Doped regions creating tailored breakdown voltages
• Metallic contacts for anode/cathode connections
• Passivation layers preventing surface leakage
• Thermal management structures (e.g., heat spreaders)

Common packaging types include SOIC, TSSOP, and DIP formats with standardized pinouts.

4. Key Technical Specifications

Parameter	Description	Typical Range
Zener Voltage (Vz)	Voltage regulation setpoint	2.4V - 200V
Power Dissipation (Pd)	Maximum thermal energy handling	100mW - 5W
Zener Current (Iz)	Operating current range	1mA - 100mA
Dynamic Impedance (Zz)	Voltage variation under load	1 - 50
Temperature Coefficient	Voltage stability vs temperature	0.05%/ C

5. Application Fields

Key industries utilizing Zener arrays include:

• Telecommunications: Line protection for transceivers
• Automotive: ECU voltage stabilization
• Industrial Control: Sensor signal conditioning
• Consumer Electronics: Power management circuits

Typical devices: SMPS converters, IoT sensors, motor controllers.

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
ON Semiconductor	NUP4106	6-channel ESD protection array
STMicroelectronics	SMF48A	48V bidirectional protection
NXP Semiconductors	PESD1CAN	Automotive CAN bus protection
Texas Instruments	ZHCS100	Ultra-low leakage voltage reference

7. Selection Guidelines

Key selection criteria:

• Match Vz to target regulation voltage ( 5% tolerance)
• Verify Pd rating exceeds maximum power dissipation
• Consider package thermal resistance
• Select appropriate leakage current level
• For arrays: Ensure channel independence and crosstalk specifications

Application Case: In automotive ECU design, NXP PESD1CAN selected for its AEC-Q100 qualification and 40kV ESD robustness.

8. Industry Trends

Emerging trends include:

• Miniaturization: 0.4mm pitch WLCSP packages
• Integration with TVS diodes for hybrid protection
• Wide bandgap materials (SiC) for higher Vz stability
• Automotive-grade arrays supporting 48V systems
• RoHS-compliant packaging materials

Market demand driven by 5G infrastructure and EV battery management systems.