1. Overview

Rectifier arrays are discrete semiconductor devices integrating multiple diodes in a single package to perform AC-to-DC conversion, voltage clamping, or signal demodulation. These arrays are critical in power management systems, enabling efficient energy conversion and circuit protection. Their compact design reduces PCB space requirements while maintaining reliability in high-current or high-voltage applications.

2. Main Types and Functional Classification

3. Structure and Composition

Rectifier arrays typically use silicon epitaxial planar technology with diffusion-bonded junctions. Standard packages include:

• TO-220/TO-247 for high-power applications
• SOIC/SOT-23 for surface-mount designs
• Dual-inline packages (DIP) with through-hole mounting

Internal structure features monolithically integrated diodes with shared thermal vias, while advanced devices employ silicon carbide (SiC) for higher efficiency.

4. Key Technical Parameters

5. Application Areas

• Power Supplies: Switch-mode power supplies (SMPS), battery chargers
• Automotive: Alternator rectification, onboard chargers
• Industrial: Motor drives, welding inverters
• Renewables: Solar micro-inverters, wind turbine converters
• Consumer: TV power adapters, LED lighting drivers

6. Leading Manufacturers and Products

7. Selection Guidelines

• Calculate required V_RRM with 20% safety margin
• Verify I_F(AV) against RMS current values
• Select package based on thermal dissipation needs
• Consider SiC/GaN alternatives for high-frequency designs
• Evaluate RoHS compliance for environmental requirements

8. Industry Trends

Key developments include:

• Transition to wide bandgap materials (SiC/GaN) for 90%+ efficiency
• Miniaturization through chip-scale packaging
• Integrated protection features (TVS + rectifier arrays)
• Automotive-grade devices for 800V EV systems
• AI-driven failure prediction models in manufacturing