Software, Services

Image Part Number Description / PDF Quantity Rfq
MIKROE-1943

MIKROE-1943

MikroElektronika

MIKROC PRO FOR PIC (CODE LICENSE

0

52110-330

52110-330

Custom Computer Services

PCBL C-COMPILER

0

MIKROE-1947

MIKROE-1947

MikroElektronika

MIKROPASCAL PRO FOR PIC

0

DBV

DBV

Comet America

DATABASE VIEWER

20

PIS-0798

PIS-0798

Pi Supply

PI-HOLE 16GB SD CARD IMAGE

8

EF-DI-DISPLAYPORT-SITE

EF-DI-DISPLAYPORT-SITE

Xilinx

SITE LICENSE DISPLAYPORT

0

SW-PE-FLT-ADD

SW-PE-FLT-ADD

Intel

QUARTUS PRO ADD FLOAT

0

2702191

2702191

Phoenix Contact

FL MGUARD LIC OPC INSP

0

TMDSCCS-ALLF05

TMDSCCS-ALLF05

Texas Instruments

CODE COMPOSER STUDIO IDE

0

CORDIC-SC-U1

CORDIC-SC-U1

Lattice Semiconductor

IP CORE CORDIC ALGO SC/SCM CONF

0

CIC-FILT-P2-UT2

CIC-FILT-P2-UT2

Lattice Semiconductor

IP CORE CIC FILTER ECP2

0

FIR-COMP-E2-UT4

FIR-COMP-E2-UT4

Lattice Semiconductor

SITE LICENSE FIR GEN EC/ECP CONF

0

CWP-BASIC-FL

CWP-BASIC-FL

NXP Semiconductors

SOFTWARE CW BASIC PERP FLOATING

0

PIS-0453

PIS-0453

Pi Supply

MAX2PLAY / JUSTBOOM 16GB MICROSD

0

SRIO-PM-UT1

SRIO-PM-UT1

Lattice Semiconductor

SITE LICENSE SRIO 2.1 ECP2M

0

CIC-FILT-E2-U2

CIC-FILT-E2-U2

Lattice Semiconductor

IP CORE CIC FILTER EC/ECP

0

PCI-EXP1-E5-U

PCI-EXP1-E5-U

Lattice Semiconductor

PCIE X1 FOR ECP5

0

DAFIR-GEN-XM-U2

DAFIR-GEN-XM-U2

Lattice Semiconductor

DEV IP CORE DA-FIR GEN XP

0

MDKPR-KD-40000

MDKPR-KD-40000

Keil (ARM)

MDK-PRO FLEX LICENSE

0

112990130

112990130

Seeed

4GB USB FOR GROVE BEGINNER KIT

91

Software, Services

1. Overview

Development boards, kits, programmers, software, and services form the foundation of modern electronics and software development. These tools enable engineers to prototype, test, and deploy hardware-software systems across various industries. Development boards are printed circuit boards with microcontrollers/microprocessors for testing electronic components. Kits integrate multiple components for specific applications, while programmers provide firmware/software flashing capabilities. Associated software and services streamline development workflows through IDEs, debuggers, and cloud integration.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Embedded Development BoardsSingle-board computers with onboard processors, memory, and I/O interfacesArduino Uno, Raspberry Pi 4
FPGA Development KitsProgrammable logic devices with reconfigurable hardwareXilinx Zynq UltraScale+, Intel Cyclone 10
Microcontroller KitsIntegrated development platforms with sensors and actuatorsSTM32 Nucleo, TI LaunchPad
ISP ProgrammersIn-System Programming tools for microcontroller firmwareST-LINK/V2, PICkit 3
Cloud-Connected Dev PlatformsIoT-enabled boards with wireless communication modulesESP32 DevKitC, NVIDIA Jetson Nano

3. Structure and Components

Typical development systems include:

  • Central Processing Unit (CPU/GPU/FPGA): Core computational element
  • Memory Subsystem: RAM, Flash, EEPROM for data storage
  • Communication Interfaces: USB, UART, SPI, I2C, Ethernet, Wi-Fi/Bluetooth
  • Power Management: Voltage regulators, power connectors
  • Expansion Headers: GPIO pins for peripheral integration
  • Debugging Interfaces: JTAG/SWD ports for firmware analysis

4. Key Technical Specifications

ParameterImportance
Processing Frequency (MHz/GHz)Determines computational performance
Memory Capacity (RAM/Flash)Limits application complexity and data storage
Interface Types and CountDictates peripheral connectivity options
Power Consumption (mW/MW)Critical for battery-powered applications
Operating Temperature RangeDefines environmental tolerance
Supported OS/Development ToolsAffects software ecosystem compatibility

5. Application Areas

Primary industry applications:

  • Internet of Things (IoT): Smart sensors, edge computing devices
  • Industrial Automation: PLC controllers, motor drivers
  • Consumer Electronics: Wearables, smart home devices
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive Systems: ADAS prototyping, ECU development
  • Education: STEM training platforms and robotics kits

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
STMicroelectronicsSTM32 MCU
Xilinx (AMD)Zynq UltraScale+ MPSoC
NXP Semiconductorsi.MX RT1060
Arduino SAArduino MKR Zero, Portenta H7
Intel CorporationIntel FPGA Cyclone V SoC

7. Selection Guidelines

Key considerations for product selection:

  • Project Requirements: Match processor architecture (ARM/RISC-V/x86) and performance
  • Ecosystem Compatibility: Ensure availability of drivers, libraries, and OS support
  • Cost vs. Performance: Balance BOM cost with required computational resources
  • Scalability: Choose platforms with upgradeable components and modular design
  • Certification Needs: Consider pre-certified modules for regulated industries
  • Community Support: Evaluate available documentation, forums, and example projects

8. Industry Trends Analysis

Current development trends include:

  • AI Acceleration: Integration of neural processing units (NPUs) in SoCs
  • Edge Computing: Shift toward on-device ML inference capabilities
  • Open-Source Hardware: Growth of RISC-V architecture adoption
  • Cloud Integration: Seamless connection to AWS/GCP/Azure IoT platforms
  • Low-Power Design: Emphasis on energy-efficient architectures for wearable devices
  • Security Enhancement: Built-in hardware security modules (HSMs) for secure boot

Future directions indicate increased convergence of hardware-software co-design tools and AI-driven development environments.

RFQ BOM Call Skype Email
Top