Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
AG921-07E

AG921-07E

NVE Corporation

AKL002 GEAR-TOOTH SENSOR DEMO

25

AG932-07E

AG932-07E

NVE Corporation

ADT002 ROTATION SENSOR EVAL KIT

63

AG903B-07E

AG903B-07E

NVE Corporation

AAL024-10E CURRENT SENS EVAL BRD

7

AG001-01E

AG001-01E

NVE Corporation

KIT ENGINEERING EVALUATION

131

AG931-07E

AG931-07E

NVE Corporation

AAT003 TMR ANGLE SENSOR EVAL KIT

1113

AG911-07E

AG911-07E

NVE Corporation

KIT EVALUATION GMR SWITCH

11

AG934-07E

AG934-07E

NVE Corporation

ATT101 ANGLE SENSOR EVAL KIT

36

AG920-07E

AG920-07E

NVE Corporation

KIT EVALUATION GT SENSOR

5

AG040C

AG040C

NVE Corporation

ADL021 EXTERNAL POWERED DEMO BRD

10

AG953-07E

AG953-07E

NVE Corporation

SM225-10E SMART TMR MAG EVAL KIT

86

AG933-07E

AG933-07E

NVE Corporation

AAT009 TMR ANGLE SENSOR EVAL KIT

27

AG956-07E

AG956-07E

NVE Corporation

ASR002-10E TMR EVAL KIT

8

AG040B

AG040B

NVE Corporation

ADL021 BATTERY POWERED DEMO BRD

14

AG951-07E

AG951-07E

NVE Corporation

SM324-10E SMART TMR MAG EVAL KIT

89

AG930-07E

AG930-07E

NVE Corporation

TMR ANGLE SENSOR EVAL BOARD

512

AG910-07E

AG910-07E

NVE Corporation

KIT EVALUATION GMR SWITCH

10

AG940-07E

AG940-07E

NVE Corporation

MAGNETIC SENSOR DEMO BOARD

55

AG952-07E

AG952-07E

NVE Corporation

SM124-10E SMART GMR MAG EVAL KIT

219

AG003-01E

AG003-01E

NVE Corporation

ASSEMBLY CURRENT SENSOR EVAL

0

AG001-01

AG001-01

NVE Corporation

KIT ENGINEERING EVALUATION

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

RFQ BOM Call Skype Email
Top