Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
NN AMC 1581 PCEV

NN AMC 1581 PCEV

Neonode

EVAL KIT MODULE 90 DEG 158MM

185

NNAMC2300PCEV

NNAMC2300PCEV

Neonode

EVAL KIT MODULE 0 DEG 230MM

101

NNAMC1580PCEV

NNAMC1580PCEV

Neonode

EVAL KIT MODULE 0 DEG 158MM

88

NNAMC1220PCEV

NNAMC1220PCEV

Neonode

EVAL KIT MODULE 0 DEG 122MM

64

NN AMC 2301 PCEV

NN AMC 2301 PCEV

Neonode

EVAL KIT MODULE 90 DEG 230MM

125

NNAMC2950PCEV

NNAMC2950PCEV

Neonode

EVAL KIT MODULE 0 DEG 295MM

69

NNAMC3460PCEV

NNAMC3460PCEV

Neonode

EVAL KIT MODULE 0 DEG 346MM

94

NNAMC1800PCEV

NNAMC1800PCEV

Neonode

EVAL KIT MODULE 0 DEG 180MM

68

NN AMC 3100 PCEV

NN AMC 3100 PCEV

Neonode

EVAL KIT MODULE 0 DEG 310MM

104

NNAMC2090PCEV

NNAMC2090PCEV

Neonode

EVAL KIT MODULE 0 DEG 209MM

98

NN AMC 1151 PCEV

NN AMC 1151 PCEV

Neonode

EVAL KIT MODULE 90 DEG 115MM

174

NNAMCMAXIPCEX

NNAMCMAXIPCEX

Neonode

FULLRANGE EXPLORER KIT 7 MODULES

50

NN AMC 1801 PCEV

NN AMC 1801 PCEV

Neonode

EVAL KIT MODULE 90 DEG 180MM

34

NN AMC 1221 PCEV

NN AMC 1221 PCEV

Neonode

EVAL KIT MODULE 90 DEG 122MM

34

NN AMC 3101 PCEV

NN AMC 3101 PCEV

Neonode

EVAL KIT MODULE 90 DEG 310MM

219

NN AMC 2951 PCEV

NN AMC 2951 PCEV

Neonode

EVAL KIT MODULE 90 DEG 295MM

31

NN AMC 2091 PCEV

NN AMC 2091 PCEV

Neonode

EVAL KIT MODULE 90 DEG 209MM

31

NN AMC 3461 PCEV

NN AMC 3461 PCEV

Neonode

EVAL KIT MODULE 90 DEG 346MM

170

NN AMC MAXIPCEY

NN AMC MAXIPCEY

Neonode

FULL RANGE EXPLORER KIT

25

NN AMC 1150 PCEV

NN AMC 1150 PCEV

Neonode

EVAL KIT MODULE 0 DEG 115MM

100

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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