Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
DEMO KIT

DEMO KIT

TOKO / Murata

KIT DEMO 4 SENSOR CHAN RS232

0

SCP1000 PCB3

SCP1000 PCB3

TOKO / Murata

SENSOR I2C 30-120KPA PCB

0

CMR3000-D01 DEMO

CMR3000-D01 DEMO

TOKO / Murata

KIT DEMO GYRO CMR3000-D01

0

CMR3000-D01 PWB

CMR3000-D01 PWB

TOKO / Murata

BOARD PWB GYRO 3-AXIS SPI/I2C

0

SCA3000-D01 PWB

SCA3000-D01 PWB

TOKO / Murata

BOARD PWB W/SCA3000-D01

0

CMA3000-D01 PWB

CMA3000-D01 PWB

TOKO / Murata

BOARD PWB ACCEL 3-AXIS SPI/I2C

0

CMA3000-A01 PWB

CMA3000-A01 PWB

TOKO / Murata

BOARD PWB ACCEL 3AXIS ANALG OUT

0

SCP1000 PCB1

SCP1000 PCB1

TOKO / Murata

SENSOR SPI 30-120KPA PCB

0

CMA3000-D01 DEMOKIT

CMA3000-D01 DEMOKIT

TOKO / Murata

KIT DEMO ACCELEROMTR CMA3000-D01

0

SCA103T-D05-PCB

SCA103T-D05-PCB

TOKO / Murata

EVAL BOARD SCA103T-D05

0

SCP1000-D01 DEMO

SCP1000-D01 DEMO

TOKO / Murata

SCP1000 DEMO KIT

0

SCA3000-E01 PWB

SCA3000-E01 PWB

TOKO / Murata

BOARD PWB W/SCA3000-E01

0

SCA3100-D04 DEMO

SCA3100-D04 DEMO

TOKO / Murata

KIT DEMO ACCELEROMETER SCA3100

0

SCA100T-D07-PCB

SCA100T-D07-PCB

TOKO / Murata

EVAL BOARD SCA100T-D07

0

SCA3000-E02 PWB

SCA3000-E02 PWB

TOKO / Murata

BOARD PWB W/SCA3000-E02

0

SCA3000-D01DEMO

SCA3000-D01DEMO

TOKO / Murata

SCA3000-D01 DEMOKIT

0

SCA1000-N1000070-PCB

SCA1000-N1000070-PCB

TOKO / Murata

EVAL BOARD SCA1000-N1000070

0

SCA3000-D02 PWB

SCA3000-D02 PWB

TOKO / Murata

BOARD PWB W/SCA3000-D02

0

SCC1300-D02DEMO

SCC1300-D02DEMO

TOKO / Murata

DEMO KIT WITH SCC1300-D02

0

PKGX-16-4021

PKGX-16-4021

TOKO / Murata

SHOCK SENSOR EVAL BOARD

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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