Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
MMC3630KJ-B

MMC3630KJ-B

MEMSIC

BOARD EVAL MMC3630KJ MAGN SENSOR

13

MMC34160PJ-B

MMC34160PJ-B

MEMSIC

BOARD EVAL MMC34160 MAGN SENSOR

2

MMC5603NJ-B

MMC5603NJ-B

MEMSIC

DEV BOARD FOR MMC5603NJ

29

MXR7900CF-B

MXR7900CF-B

MEMSIC

BOARD EVAL FOR MXR7900CF

0

EV3635B

EV3635B

MEMSIC

EVALUATION BOARD FOR MC3635

0

MXP7205VW-B

MXP7205VW-B

MEMSIC

BOARD EVAL FOR MXR7205VW

0

MXR9500MZ-B

MXR9500MZ-B

MEMSIC

BOARD EVAL FOR MXR9500MZ

11

MMC5983MA-B

MMC5983MA-B

MEMSIC

DEV BOARD FOR MMC5983MA

36

MXR2999EL-B

MXR2999EL-B

MEMSIC

BOARD EVAL FOR MXR2999EL

0

MXR9150MZ-B

MXR9150MZ-B

MEMSIC

BOARD EVAL FOR MXR9150MZ

7

MXC62320MP-B

MXC62320MP-B

MEMSIC

BOARD EVAL FOR MXC62320MP

0

MMC5883MA-B

MMC5883MA-B

MEMSIC

DEVELOPMENT BOARD FOR MMC5883MA

16

MXR7305VF-B

MXR7305VF-B

MEMSIC

BOARD EVAL FOR MXR7305VF

0

MXP7205VF-B

MXP7205VF-B

MEMSIC

BOARD EVAL FOR MXP7205VW

0

DB3672B

DB3672B

MEMSIC

DEMO BOARD FOR MC3672 AND MC3635

20

MXA2500EL-B

MXA2500EL-B

MEMSIC

BOARD EVAL FOR MXA2500EL

0

MXC4005XC-B

MXC4005XC-B

MEMSIC

MXC4XX5-B PROTOTYPING BOARD

9

MXC6655XA-B

MXC6655XA-B

MEMSIC

EVAL BOARD FOR MXC6655

0

MXD6241AU-B

MXD6241AU-B

MEMSIC

BOARD EVAL MXD6241 TIP OVER SENS

0

MXC6245XU-B

MXC6245XU-B

MEMSIC

BOARD EVAL ACCEL 2AXIS MXC6245XU

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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