Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
LMT90EVM

LMT90EVM

Texas Instruments

EVAL MODULE FOR LMT90

1

TMP390EVM

TMP390EVM

Texas Instruments

DEVELOPMENT DATA ACQUISITION

12

LDC0851EVM

LDC0851EVM

Texas Instruments

EVAL BOARD FOR LDC0851

19

TMP117EVM

TMP117EVM

Texas Instruments

DEVELOPMENT POWER MANAGEMENT

41

HDC2010EVM

HDC2010EVM

Texas Instruments

HDC2010 LOW POWER HUMIDITY AND T

15

LDC1314EVM

LDC1314EVM

Texas Instruments

EVAL MODULE FOR LDC1314

6

LMT70EVM

LMT70EVM

Texas Instruments

EVAL MODULE FOR LMT70

15

TMP468EVM

TMP468EVM

Texas Instruments

EVAL BOARD FOR TMP468

9

430BOOST-SENSE1

430BOOST-SENSE1

Texas Instruments

CAP TOUCH BOOSTER FOR LAUNCH PAD

969

HDC1000EVM

HDC1000EVM

Texas Instruments

BOARD EVAL FOR HDC1000

61

SENSOREMULATOREVM

SENSOREMULATOREVM

Texas Instruments

EMULATOR SENSOR

1

TMP007EVM

TMP007EVM

Texas Instruments

EVAL BOARD IR THERMOPILE TMP007

2

DLPNIRNANOEVM

DLPNIRNANOEVM

Texas Instruments

EVAL NEAR-INFRARED SPECTROMETER

12

TSC2007EVM-PDK

TSC2007EVM-PDK

Texas Instruments

TSC2007EVM-PDK

2

DRV5011-5012EVM

DRV5011-5012EVM

Texas Instruments

EVAL BOARD DRV5011 DRV5012

2

TMP709EVM

TMP709EVM

Texas Instruments

EVAL MODULE FOR TMP709

1

TMP107EVM

TMP107EVM

Texas Instruments

EVALUATION MODULE TMP107

5

FDC1004QEVM

FDC1004QEVM

Texas Instruments

EVAL MOD CAP-DGTL CONV FDC1004

11

LDC1614EVM

LDC1614EVM

Texas Instruments

EVAL MODULE FOR LDC1614

25

430BOOST-TMP006

430BOOST-TMP006

Texas Instruments

BOOSTER PACK ADP BOARD TMP006

4

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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