Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
68010305-001

68010305-001

Honeywell Aerospace

HG1120 ADAPTOR BOARD

6

HMC5883L-DEMO

HMC5883L-DEMO

Honeywell Aerospace

IC COMPASS 3 AXIS I2C DEMO KIT

1

68009732-001

68009732-001

Honeywell Aerospace

HG4930 EVALUATION KIT

2

68010308-001

68010308-001

Honeywell Aerospace

HG4930 ADAPTOR BOARD

6

HMR3300-DEMO-232

HMR3300-DEMO-232

Honeywell Aerospace

KIT DEVEL DIG COMPASS MOD RS232

0

HMC6343-EVAL

HMC6343-EVAL

Honeywell Aerospace

EVAL BOARD FOR HMC6343

0

68009732-002

68009732-002

Honeywell Aerospace

HG1120 EVALUATION KIT

6

68010029-001

68010029-001

Honeywell Aerospace

HGUIDE N580 EVALUATION KIT WITH

1

HMR2300-D21-485-DEMO

HMR2300-D21-485-DEMO

Honeywell Aerospace

DEV KIT MAGNETOMETER RS485

0

68010029-003

68010029-003

Honeywell Aerospace

HGUIDE N580 EVALUATION KIT WITH

1

68010029-002

68010029-002

Honeywell Aerospace

HGUIDE N580 EVALUATION KIT WITH

1

HMC1042L/HMC1041Z-DEMO

HMC1042L/HMC1041Z-DEMO

Honeywell Aerospace

DEMO BOARD FOR HMC1042L/HMC1041Z

0

HMR3000-232-DEMO

HMR3000-232-DEMO

Honeywell Aerospace

KIT DEMO DIG COMPASS MODUL RS232

0

HMR3200-DEMO-232

HMR3200-DEMO-232

Honeywell Aerospace

KIT DEVEL DIG COMPASS MOD RS232

0

HMC5983-DEMO

HMC5983-DEMO

Honeywell Aerospace

BOARD DEMO 3AXIS COMPASS HMC5983

0

HMR2300-D21-232-DEMO

HMR2300-D21-232-DEMO

Honeywell Aerospace

KIT DEVELOP MAGNETOMETER RS232

0

HMC6343-DEMO

HMC6343-DEMO

Honeywell Aerospace

DEMONSTRATION BOARD FOR HMC6343

0

HMC5983-EVAL

HMC5983-EVAL

Honeywell Aerospace

BOARD EVAL 3AXIS COMPASS HMC5983

0

HMC1043-DEMO

HMC1043-DEMO

Honeywell Aerospace

DEMONSTRATION BOARD FOR HMC1043

0

HMC1023-PCB

HMC1023-PCB

Honeywell Aerospace

BOARD EVALUATION W/HMC1023 SENS

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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