Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
SI85XX20AQFN-KIT

SI85XX20AQFN-KIT

Silicon Labs

KIT DEVELOPMENT FOR SI85XX20AQFN

0

SI118X-KIT

SI118X-KIT

Silicon Labs

EVAL KIT SI118X BIOMETRIC

0

IRSLIDEREK

IRSLIDEREK

Silicon Labs

BOARD EVAL IR SLIDER SI1120

0

CAPTOUCHSENSESK

CAPTOUCHSENSESK

Silicon Labs

KIT STARTER CAP TOUCH SENSE

0

UVIRSLIDER2EK

UVIRSLIDER2EK

Silicon Labs

KIT UB INDEX SI114X SI1132

0

SI85XX-EVB

SI85XX-EVB

Silicon Labs

BOARD EVAL CURRENT SENSOR 10A

0

KEYBOARDEK

KEYBOARDEK

Silicon Labs

DEVELOPMENT KIT KEYBOARD

0

F350-COMPASS-RD

F350-COMPASS-RD

Silicon Labs

KIT REFERENCE DESIGN DGTL COMPSS

0

KEYMATEK

KEYMATEK

Silicon Labs

BOARD EVAL ITO FILM F800

0

SI72XX-WD-KIT

SI72XX-WD-KIT

Silicon Labs

DEMO AND DEVELOPMENT KIT FOR SI7

0

SENSOR-PUCK

SENSOR-PUCK

Silicon Labs

EVAL BOARD OPTICAL RH TEMP BLE

0

CAPTOUCHSENSEDC

CAPTOUCHSENSEDC

Silicon Labs

DAUGHTER CARD CAP TOUCH SENSE

0

FRONTPANEL1EB

FRONTPANEL1EB

Silicon Labs

DEMO TOUCH FRONT PANEL C8051F700

0

SI85XX5KV-EVB

SI85XX5KV-EVB

Silicon Labs

EVAL BOARD FOR SI85XX5KV

0

SI7005USB-EVB

SI7005USB-EVB

Silicon Labs

BOARD EVAL FOR SI7005

0

SI1141-A11-GDI

SI1141-A11-GDI

Silicon Labs

DEVELOPMENT EMBEDDED

0

HRM44-GGG-PS

HRM44-GGG-PS

Silicon Labs

POSTAGE STAMP BOARD SI1144

0

SI1147DK

SI1147DK

Silicon Labs

DEVELOPMENT EMBEDDED

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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