Evaluation Boards

Evaluation Boards - Sensors

Part Number	Description / PDF	Quantity
CY8CKIT-148-COIL Cypress Semiconductor	INDUCTIVE SENSING EVAL	10
CY3280-MBR Cypress Semiconductor	BOARD EVAL CAPSENSE EXPRESS	25
CY8CKIT-024 Cypress Semiconductor	DEV KIT PROXIMITY SHIELD PSOC 4	21
CY3280-MBR3 Cypress Semiconductor	BOARD EVAL CAPSENSE EXPRESS	37
CY8CKIT-148 Cypress Semiconductor	INDUCTIVE SENSING EVALUATION	11
CY3220-FPD Cypress Semiconductor	KIT DEMO PSOC CAPSENSE	1
CY3235-PROXDET Cypress Semiconductor	KIT EVAL PSOC PROX DETECT	0
CY3213A-CAPSENSE Cypress Semiconductor	KIT EVAL CAPSENSE SIGMA DELTA	0
CY3236A-PIRMOTION Cypress Semiconductor	KIT PIR MOTION DETECT	0
CY3220-SLIDER Cypress Semiconductor	KIT DEMO PSOC CAPSENSE SLIDE	0
CY3280-SLM Cypress Semiconductor	MODULE LINEAR SLIDER CAPSENSE	0
CY3218-CAPEXP3 Cypress Semiconductor	KIT CAPSENSE EXPRESS CY8C20142	0
CY8CKIT-025 Cypress Semiconductor	BOARD PSOC ANALOG TEMP SENSOR	0
CY3218-CAPEXP1 Cypress Semiconductor	KIT CAPSENSE EXPRESS CY8C20110	0
CY8CKIT-022 Cypress Semiconductor	KIT LIQUID LEVEL SENSING	0
CY3203A-CAPSENSE Cypress Semiconductor	KIT EVAL CAPSENSE CSA	0
CYII4SM014K-EVAL Cypress Semiconductor	BOARD EVAL IMAG SENS IBIS4-14000	0
CYII5FM1300-EVAL Cypress Semiconductor	BOARD EVAL IMG SENS IBIS5-B-1300	0
CY3280-SRM Cypress Semiconductor	MODULE RADIAL SLIDER CAPSENSE	0
CYII4SM6600-EVAL Cypress Semiconductor	BOARD EVAL IMAGE SENS IBIS4-6600	0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Temperature Sensor Boards	High-precision thermal sensing with digital/analog outputs	Climate control systems, medical devices
Accelerometer Boards	3-axis motion detection with programmable sensitivity	Vibration monitoring, fitness trackers
Pressure Sensor Boards	Atmospheric/differential pressure measurement	Weather stations, automotive systems
Environmental Sensor Boards	Multi-parameter detection (humidity, gas, light)	Smart agriculture, air quality monitors
Image Sensor Boards	High-resolution optical sensing with ISP integration	Surveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

Parameter	Description	Importance
Measurement Range	Minimum/maximum detectable values	Determines application suitability
Accuracy	Error margin vs. reference values	Impacts system reliability
Sampling Rate	Data acquisition frequency	Defines dynamic response capability
Power Consumption	Operating current/voltage requirements	Affects battery life and thermal design
Interface Type	Communication protocol compatibility	Dictates system integration complexity

5. Application Areas

Industrial Automation: Predictive maintenance systems, process control
Healthcare: Wearable vital sign monitors, diagnostic equipment
Consumer Electronics: Smart home devices, mobile accessories
Automotive: Tire pressure monitoring, ADAS sensors
Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
STMicroelectronics	STEVAL-MKI187V1	6-axis IMU with advanced calibration
Texas Instruments	BOOSTXL-ULTRASONIC	Ultrasonic sensing for distance measurement
Analog Devices	EVAL-ADICUP3029	Low-power Cortex-M4F based platform
NXP Semiconductors	FRDM-FXS-MULTI-B	Multi-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.