Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
SHUTTLE BOARD SET BHA260AB

SHUTTLE BOARD SET BHA260AB

Bosch Sensortec

SHUTTLE BOARD DEV KIT BHA260AB

6

BMG250-SHUTL

BMG250-SHUTL

Bosch Sensortec

BMG250 - GYROSCOPE 3-AXIS SPI/I2

33

BNO055 USB-STICK

BNO055 USB-STICK

Bosch Sensortec

BNO055 USB-STICK EVAL KIT

23

SHUTTLE BOARD BMA400

SHUTTLE BOARD BMA400

Bosch Sensortec

EVAL BOARD FOR BMA400

62

BME280-SHUTL

BME280-SHUTL

Bosch Sensortec

SHUTTLE BOARD DEV KIT BME280

15

BMP280-SHUTL

BMP280-SHUTL

Bosch Sensortec

SHUTTLE BOARD DEV KIT BMP280

5

BHA250-SHUTL

BHA250-SHUTL

Bosch Sensortec

BHA250 - ANDROID SENSOR HUB, 3-A

4

SHUTTLE BOARD BMI085

SHUTTLE BOARD BMI085

Bosch Sensortec

EVAL BOARD FOR BMI085

27

SHUTTLE BOARD BME688

SHUTTLE BOARD BME688

Bosch Sensortec

SHUTTLE BOARD BME688

0

SHUTTLE BOARD BHI160B

SHUTTLE BOARD BHI160B

Bosch Sensortec

SHUTTLE BOARD DEV KIT BHI160B

20

SHUTTLE BOARD SET BHI260AP

SHUTTLE BOARD SET BHI260AP

Bosch Sensortec

SHUTTLE BOARD BHI260AP

0

BMC150-SHUTL

BMC150-SHUTL

Bosch Sensortec

SHUTTLE BOARD DEV KIT BMC150

0

BMA150-SHUTL

BMA150-SHUTL

Bosch Sensortec

BMA150 SHUTTLE BOARD FOR DEV KIT

0

BMA020-TRIBOX

BMA020-TRIBOX

Bosch Sensortec

BMA020 TRIBOX DEMO BOARD W/USB

0

BMA140-SHUTL

BMA140-SHUTL

Bosch Sensortec

BMA140 SHUTTLE BOARD FOR DEV KIT

0

BMA150-TRIBOX

BMA150-TRIBOX

Bosch Sensortec

BMA150 TRIBOX DEMO BOARD W/USB

0

BMC050-SHUTL

BMC050-SHUTL

Bosch Sensortec

BMC050 SHUTTLE BOARD FOR DEV KIT

0

BMA120-SHUTL

BMA120-SHUTL

Bosch Sensortec

SHUTTLE BOARD FOR DEV KIT BMA120

0

BMP085-SHUTL

BMP085-SHUTL

Bosch Sensortec

BMP085 SHUTTLE BOARD FOR DEV KIT

0

BMA145-SHUTL

BMA145-SHUTL

Bosch Sensortec

BMA145 SHUTTLE BOARD FOR DEV KIT

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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