Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
STEVAL-MKI186V1

STEVAL-MKI186V1

STMicroelectronics

EVAL BOARD FOR IIS3DHHC

0

P-NUCLEO-6180A1

P-NUCLEO-6180A1

STMicroelectronics

VL6180 BOARD WITH NUCLEO-F401RE

77

STEVAL-STWINKT1B

STEVAL-STWINKT1B

STMicroelectronics

STWIN SENSORTILE WIRELESS IND

0

STEVAL-MKI038V1

STEVAL-MKI038V1

STMicroelectronics

BOARD EVALUATION FOR LPR550AL

0

STEVAL-MKI037V1

STEVAL-MKI037V1

STMicroelectronics

EVAL BOARD FOR LPY530AL

0

STEVAL-MKI172V1

STEVAL-MKI172V1

STMicroelectronics

EVAL BOARD FOR LSM303AGR

0

AEKD-BLINDSPOTB1

AEKD-BLINDSPOTB1

STMicroelectronics

BLIND-SPOT DETECTION BOARD SET

3

STEVAL-MKI179V1

STEVAL-MKI179V1

STMicroelectronics

STEVAL-MKI179V1

33

STEVAL-MKI165V1

STEVAL-MKI165V1

STMicroelectronics

ADAPTER BOARD LPS25HB 24DIL SKT

23

STEVAL-MKI185V1

STEVAL-MKI185V1

STMicroelectronics

EVAL BOARD FOR IIS2MDC

31

STEVAL-MKI034V1

STEVAL-MKI034V1

STMicroelectronics

EVAL BOARD FOR LPR510AL

0

STEVAL-MKI203V1K

STEVAL-MKI203V1K

STMicroelectronics

MEMS MOTION SENSOR EVAL BOARDS

15

STEVAL-MKI195V1

STEVAL-MKI195V1

STMicroelectronics

MEMS MOTION SENSOR EVAL BOARDS

43

STEVAL-BFA001V2B

STEVAL-BFA001V2B

STMicroelectronics

MULTI-SENSOR PREDICTIVE MAINTENA

119

STEVAL-MKI205V1

STEVAL-MKI205V1

STMicroelectronics

MEMS MOTION SENSOR EVAL BOARDS

11

STEVAL-IFS012V7

STEVAL-IFS012V7

STMicroelectronics

EVAL DAUGHTER STDS75 8-TSSOP

0

STEVAL-MKI184V1

STEVAL-MKI184V1

STMicroelectronics

EVAL BOARD FOR ISM303DAC

2

STEVAL-MKI047V1

STEVAL-MKI047V1

STMicroelectronics

BOARD EVALUATION FOR LPR550AL

0

STEVAL-MKI106V1

STEVAL-MKI106V1

STMicroelectronics

BOARD EVAL LSM303DLHC

0

P-NUCLEO-53L1A2

P-NUCLEO-53L1A2

STMicroelectronics

VL53L1CB NUCLEO PACK

17

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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