Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
4103

4103

Pololu Corporation

QTR-HD-03RC REF ARRAY 3CHNL

105

4145

4145

Pololu Corporation

QTR-MD-05RC REF ARRAY 5CHNL

63

4413

4413

Pololu Corporation

QTRX-HD-13A REF ARRAY 13CHNL

65

4211

4211

Pololu Corporation

QTR-HD-11A REF ARRAY 11CHNL

33

4042

4042

Pololu Corporation

ACS724 CURRENT SENSOR 0-10A

0

4431

4431

Pololu Corporation

QTRX-HD-31A REF ARRAY 31CHNL

19

2454

2454

Pololu Corporation

QTR-L-1A REFLECTANCE SENSOR 2PK

201

1132

1132

Pololu Corporation

SHARP GP2Y0D805Z0F CARRIER 5CM

283

4141

4141

Pololu Corporation

QTR-MD-01RC REF SENSOR 1CHNL

249

4446

4446

Pololu Corporation

QTRX-MD-06A REF ARRAY 6CHNL

50

4144

4144

Pololu Corporation

QTR-MD-04RC REF ARRAY 4CHNL

71

3577

3577

Pololu Corporation

BALBOA REFLECTANCE SENSOR ARRAY

47

4344

4344

Pololu Corporation

QTRX-MD-04RC REF ARRAY 4CHNL

62

4049

4049

Pololu Corporation

ACS724 Current Sensor +/-50A

131

4303

4303

Pololu Corporation

QTRX-HD-03RC REF ARRAY 3CHNL

140

4201

4201

Pololu Corporation

QTR-HD-01A REF SENSOR 1CHNL

349

4142

4142

Pololu Corporation

QTR-MD-02RC REF ARRAY 2CHNL

102

4501

4501

Pololu Corporation

QTRXL-HD-01RC REF SENSOR 1CHNL

265

4356

4356

Pololu Corporation

QTRX-MD-16RC REF ARRAY 16CHNL

66

4409

4409

Pololu Corporation

QTRX-HD-09A REF ARRAY 9CHNL

38

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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