Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
F990SLIDEREK

F990SLIDEREK

Silicon Labs

EVAL CAPACITIVE TOUCH SLIDER

0

IQS263EV02-S

IQS263EV02-S

Azoteq

IQS263 EVALUATION KIT 2

22

KITMPR03XEVM

KITMPR03XEVM

NXP Semiconductors

KIT EVAL FOR MPR03X

0

4042

4042

Pololu Corporation

ACS724 CURRENT SENSOR 0-10A

0

IQS127DEV01-S

IQS127DEV01-S

Azoteq

IQS127D EVALUATION KIT 1

52

DK-CH201

DK-CH201

TDK InvenSense

CHIRP CH-201 DEVELOPMENT BOARD,

29

ASEK713ELC-20A-T-DK

ASEK713ELC-20A-T-DK

Allegro MicroSystems

BOARD DEMO 713ELC-20A SENSOR

2

4431

4431

Pololu Corporation

QTRX-HD-31A REF ARRAY 31CHNL

19

3515

3515

Adafruit

HTU21DF TEMP & HUMIDITY SENSOR B

26

TSSEVB

TSSEVB

NXP Semiconductors

BOARD EVALUATION TOUCH SENSING

0

968-021

968-021

Spec Sensors

968-021 SDK-ETOH SENSOR DEVELOPE

0

BRKT-STBC-AGM01

BRKT-STBC-AGM01

NXP Semiconductors

BREAKOUT BOARD LEON2 GAUSS

1

IPS2200STKIT

IPS2200STKIT

Renesas Electronics America

IPS2200 STARTER KIT FOR HIGH-SPE

5

EVKT820-KNOB-Q-01A

EVKT820-KNOB-Q-01A

MPS (Monolithic Power Systems)

MAGALPHA MA820 ROTARY KNOB KIT

4

EPC635-002 CC CHIP CARRIER

EPC635-002 CC CHIP CARRIER

ESPROS Photonics AG

EPC635-002 CC CHIP CARRIER

17

ADIS16265/PCBZ

ADIS16265/PCBZ

Analog Devices, Inc.

BOARD EVALUATION FOR ADIS16265

3

MMC3630KJ-B

MMC3630KJ-B

MEMSIC

BOARD EVAL MMC3630KJ MAGN SENSOR

13

TMP390EVM

TMP390EVM

Texas Instruments

DEVELOPMENT DATA ACQUISITION

12

LXK3301AR001

LXK3301AR001

Roving Networks / Microchip Technology

EVAL BOARD FOR LX3301A

1

EVAL-ADXL362Z-DB

EVAL-ADXL362Z-DB

Analog Devices, Inc.

BOARD EVAL FOR ADXL362

1

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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