Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
SEN0116

SEN0116

DFRobot

MINIQ ROBOT CHASSIS ENCODER

0

MT9M021IA3XTCH-GEVB

MT9M021IA3XTCH-GEVB

BOARD EVAL 1.2 MP 1/3" GS CIS HB

0

SI1147-M01-EVB

SI1147-M01-EVB

Silicon Labs

BOARD EVAL FOR SI1147-M01

0

BH1792GLC-EVK-001

BH1792GLC-EVK-001

ROHM Semiconductor

EVAL BOARD FOR BH1792GLC

40

STEVAL-MKI213V1

STEVAL-MKI213V1

STMicroelectronics

STEVAL-MKI213V1

37

EVAL-CN0206-SDPZ

EVAL-CN0206-SDPZ

Analog Devices, Inc.

BOARD EVAL AD7793 T THERMOCOUPLE

0

LXK3302AR001

LXK3302AR001

Roving Networks / Microchip Technology

LX3302A ROTARY EVB KIT

7

EV_MOD_CH201-00-01

EV_MOD_CH201-00-01

TDK InvenSense

CHIRP EVAL BRD FOR CH201

208

DM160221

DM160221

Roving Networks / Microchip Technology

BOARD DEMO FOR MTCH112

6

SEK-SFM3000

SEK-SFM3000

Sensirion

EVAL KIT MASS FLOW METER SFM3000

156

AS5X47P-TS_EK_MB

AS5X47P-TS_EK_MB

ams

EVAL KIT FOR AS5X47P

16

BMI055-SHUTL

BMI055-SHUTL

Bosch Sensortec

SHUTTLE BOARD DEV KIT BMI055

0

EK-P5

EK-P5

Sensirion

EVALUATION KIT SDP800 SERIES

49

113990580

113990580

Seeed

ESP32-CAM DEVELOPMENT BOARD(WITH

57

MIKROE-254

MIKROE-254

MikroElektronika

BOARD 3-AXIS ACCELEROMETER

2

AS5311-TS_EK_AB

AS5311-TS_EK_AB

ams

ADAPTER BOARD FOR AS5311

402

BRKTSTBC-A8471

BRKTSTBC-A8471

NXP Semiconductors

BREAKOUT BOARD FOR FXLS8471Q

19

3623V887

3623V887

Canon

3U5MGXSBAI EVAL KIT

1

ASEK-ATS343-ATS344-KIT-T-DK

ASEK-ATS343-ATS344-KIT-T-DK

Allegro MicroSystems

EVAL BOARD ASEK-ATS343-ATS344

6

TMD3782EVM

TMD3782EVM

ams

EVAL KIT SENSOR PROXIMITY/COLOR

4

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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