Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
2513254510391

2513254510391

Würth Elektronik Midcom

EVALUATION BOARD WSEN-PDUS, 0 TO

4

SEN-14520

SEN-14520

SparkFun

CAPACITIVE TOUCH BREAKOUT AT42QT

94

EVAL-ADXRS290Z-M2

EVAL-ADXRS290Z-M2

Analog Devices, Inc.

EVAL BOARD FOR ADXRS290

3

201877

201877

Watterott electronic

BME280-BREAKOUT (HUMIDITY. PRESS

1

20190001

20190001

Watterott electronic

BMP388-BREAKOUT (PRESSURE & TEMP

4

MAX-ECG-MONITOR

MAX-ECG-MONITOR

Maxim Integrated

EVAL HEART RATE/ECG W/MAX30003

2890

EVAL-ADXL312Z

EVAL-ADXL312Z

Analog Devices, Inc.

BOARD BREAKOUT FOR ADXL312Z

2

SEN-10345

SEN-10345

SparkFun

EVAL BOARD FOR LIS331HH

5

LV0111CFGEVB

LV0111CFGEVB

Sanyo Semiconductor/ON Semiconductor

EVAL BOARD LV0111CFG

0

2635

2635

Adafruit

BREAKOUT BD TEMP/HUMIDITY SENSOR

0

SEN-13963

SEN-13963

SparkFun

EVAL BOARD ACCELEROMETER LIS3DH

193

ADIS16477-3/PCBZ

ADIS16477-3/PCBZ

Analog Devices, Inc.

EVAL BOARD FOR ADIS16477-3

6

ASEK709LLF-35BB-T-DK

ASEK709LLF-35BB-T-DK

Allegro MicroSystems

BOARD DEMO 709LLF-35BB SENSOR

3

ASX340AT3C00XPEDH3-GEVB

ASX340AT3C00XPEDH3-GEVB

Sanyo Semiconductor/ON Semiconductor

BOARD EVAL VGA 1/4 CIS SOC COLOR

6

STEVAL-IFS012V12

STEVAL-IFS012V12

STMicroelectronics

EVAL DAUGHTER STTS424E02 8-TDFN

0

ASEK770ECB-200B-T-DK

ASEK770ECB-200B-T-DK

Allegro MicroSystems

BOARD DEMO 770ECB-200B SENSOR

5

PIM062

PIM062

Pimoroni

SKYWRITER

11

EVK75027-110-940-1

EVK75027-110-940-1

Melexis

BOARD EVAL 75027 TOF VCSEL ILLUM

3

AG001-01E

AG001-01E

NVE Corporation

KIT ENGINEERING EVALUATION

131

EVAL-AD7747EBZ

EVAL-AD7747EBZ

Analog Devices, Inc.

BOARD EVAL FOR AD7747

20

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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