Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
SECO-NCD5700-GEVB

SECO-NCD5700-GEVB

Sanyo Semiconductor/ON Semiconductor

APPLICATION DAUGHTER-CARD FOR IG

2

CAN-GEVB

CAN-GEVB

Sanyo Semiconductor/ON Semiconductor

EVAL BOARD CAN DRIVER SHIELD

4

HRM-GEVB

HRM-GEVB

Sanyo Semiconductor/ON Semiconductor

HART RATE MONITOR SHIELD

0

ENOCEAN-GEVB

ENOCEAN-GEVB

Sanyo Semiconductor/ON Semiconductor

EVB ENOCEAN SHIELD

0

STRUIX-GEVB

STRUIX-GEVB

Sanyo Semiconductor/ON Semiconductor

EVAL BOARD STRUIX SHIELD

0

LV8968BBGEVB

LV8968BBGEVB

Sanyo Semiconductor/ON Semiconductor

EVAL MOTOR DR LV8968B

2

SIGFOX-GEVB

SIGFOX-GEVB

Sanyo Semiconductor/ON Semiconductor

SIGFOX SHIELD

0

D-STPR-GEVB

D-STPR-GEVB

Sanyo Semiconductor/ON Semiconductor

BOARD EVAL DUAL STEPPER MOTOR DR

0

D-LED-B-GEVB

D-LED-B-GEVB

Sanyo Semiconductor/ON Semiconductor

BOARD EVAL DUAL LED BALLAST SHIE

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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