Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-2474 MikroElektronika	TOUCHKEY 2 CLICK	1
MIKROE-4114 MikroElektronika	DC MOTOR 6 CLICK	22
MIKROE-2568 MikroElektronika	SPIRIT CLICK	0
MIKROE-3402 MikroElektronika	POT CLICK	3
MIKROE-2387 MikroElektronika	DIFF PRESSURE CLICK	0
MIKROE-2864 MikroElektronika	RS232 ISOLATOR CLICK	9
MIKROE-1445 MikroElektronika	BOARD PROXIMITY CLICK	2
MIKROE-3993 MikroElektronika	RS485 6 CLICK	19
MIKROE-2883 MikroElektronika	CAP EXTEND 3 CLICK	2
MIKROE-925 MikroElektronika	BOARD MEMORY RS485 CLICK 5V	40
MIKROE-2507 MikroElektronika	ECG 2 CLICK	2
MIKROE-3410 MikroElektronika	6DOF IMU 4 CLICK	10
MIKROE-1632 MikroElektronika	TRACKING AND SECURITY CLICK PACK	0
MIKROE-2264 MikroElektronika	COMPASS 2 CLICK	3
MIKROE-2534 MikroElektronika	SIGFOX CLICK	5
MIKROE-2102 MikroElektronika	ACCEL 3 CLICK	2
MIKROE-1917 MikroElektronika	COUNTER CLICK	74
MIKROE-2767 MikroElektronika	OZONE 2 CLICK	68
MIKROE-3997 MikroElektronika	COLOR 10 CLICK	19
MIKROE-3812 MikroElektronika	AMR CURRENT CLICK	2

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems