Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-4230 MikroElektronika	ISM RX 2 CLICK	4
MIKROE-3683 MikroElektronika	EINK CLICK - WITHOUT DISPLAY	10
MIKROE-3652 MikroElektronika	BUCK 12 CLICK	5
MIKROE-3400 MikroElektronika	LED DRIVER 6 CLICK	8
MIKROE-1599 MikroElektronika	XBEE CLICK	0
MIKROE-3692 MikroElektronika	M-BUS RF 4 CLICK	10
MIKROE-3744 MikroElektronika	CHARGER 12 CLICK	17
MIKROE-2733 MikroElektronika	MAC ADDRESS CLICK	2
MIKROE-1534 MikroElektronika	SPEAKUP SPEECH RECOGNITION BOARD	2
MIKROE-3885 MikroElektronika	LTE CAT.1-US CLICK	5
MIKROE-4288 MikroElektronika	RTC 11 CLICK	8
MIKROE-4185 MikroElektronika	ACCEL 14 CLICK	20
MIKROE-3050 MikroElektronika	MAGNETO 5 CLICK	3
MIKROE-1634 MikroElektronika	I LIKE IT LOUD CLICK PACK	0
MIKROE-4126 MikroElektronika	VCP MONITOR 2 CLICK	4
MIKROE-4028 MikroElektronika	SEMPER FLASH 2 CLICK	11
MIKROE-3035 MikroElektronika	NANO POWER CLICK	1
MIKROE-2333 MikroElektronika	TIMER CLICK	4
MIKROE-2436 MikroElektronika	VOLTMETER CLICK	1
MIKROE-2293 MikroElektronika	PRESSURE 3 CLICK	11

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems