Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3817 MikroElektronika	FRAM 3 CLICK	3
MIKROE-1940 MikroElektronika	FIBER OPT CLICK	19
MIKROE-1879 MikroElektronika	DEV BOARD PI2 CLICK SHIELD	19
MIKROE-3991 MikroElektronika	PROXIMITY 13 CLICK	8
MIKROE-3076 MikroElektronika	CLOCK GEN 2 CLICK	0
MIKROE-3982 MikroElektronika	DC MOTOR 14 CLICK	6
MIKROE-4453 MikroElektronika	I2C MUX 5 CLICK	5
MIKROE-4148 MikroElektronika	LIGHT MIX-SENS CLICK	4
MIKROE-1874 MikroElektronika	DEV BOARD EXPAND 3 CLICK	0
MIKROE-1995 MikroElektronika	TOUCHPAD CLICK	9
MIKROE-1447 MikroElektronika	BOARD STM32F3 DISCOVERY SHIELD	4
MIKROE-3150 MikroElektronika	PWR METER 2 CLICK	4
MIKROE-2830 MikroElektronika	LED FLASH 2 CLICK	2
MIKROE-4243 MikroElektronika	EXPAND 6 CLICK	12
MIKROE-3659 MikroElektronika	NFC TAG 4 CLICK	14
MIKROE-1911 MikroElektronika	BOARD DC MOTOR 2 CLICK	2
MIKROE-3888 MikroElektronika	GO TO CLOUD (G2C) 3G CLICK	5
MIKROE-1577 MikroElektronika	BOARD MEASUREMENT IMU CLICK	3
MIKROE-4109 MikroElektronika	POWER MUX CLICK	3
MIKROE-1298 MikroElektronika	RF TXRX MODULE CELLULAR	115

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems