Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
DPP901Z000

DPP901Z000

TE Connectivity Measurement Specialties

PMOD MS8607

0

DPP301Z000

DPP301Z000

TE Connectivity Measurement Specialties

PMOD HTU21

42

DPP901G000

DPP901G000

TE Connectivity Measurement Specialties

GROVE MS8607 DEV BOARD

7

DPP401G000

DPP401G000

TE Connectivity Measurement Specialties

GROVE KMA36 DEV BOARD

15

DPP904R000

DPP904R000

TE Connectivity Measurement Specialties

RASPBERRY PI WEATHER SHIELD

25

DPP202Z000

DPP202Z000

TE Connectivity Measurement Specialties

PMOD TSYS02D

11

DPP401A000

DPP401A000

TE Connectivity Measurement Specialties

XPLAINED PRO KMA36 (R)

5

DPP902S000

DPP902S000

TE Connectivity Measurement Specialties

ARDUINO WEATHER SHIELD

611

DPP901A000

DPP901A000

TE Connectivity Measurement Specialties

XPLAINED PRO MS8607

6

DPP202A000

DPP202A000

TE Connectivity Measurement Specialties

XPLAINED PRO TSYS02D

19

DPP202G000

DPP202G000

TE Connectivity Measurement Specialties

GROVE TSYS02D DEV BOARD

28

DPP401Z000

DPP401Z000

TE Connectivity Measurement Specialties

PMOD KMA36 (R)

9

DPP101G000

DPP101G000

TE Connectivity Measurement Specialties

GROVE MS5637 DEV BOARD

44

DPP301G000

DPP301G000

TE Connectivity Measurement Specialties

GROVE HTU21D DEV BOARD

5

DPP101A000

DPP101A000

TE Connectivity Measurement Specialties

XPLAINED PRO MS5637

5

DPP201G000

DPP201G000

TE Connectivity Measurement Specialties

GROVE TSYS01 DEV BOARD

116

DPP201A000

DPP201A000

TE Connectivity Measurement Specialties

XPLAINED PRO TSYS01

23

DPP201Z000

DPP201Z000

TE Connectivity Measurement Specialties

PMOD TSYS01

18

DPP903M000

DPP903M000

TE Connectivity Measurement Specialties

PICTAIL WEATHER BOARD

18

DPP301A000

DPP301A000

TE Connectivity Measurement Specialties

XPLAINED PRO HTU21

13

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
RFQ BOM Call Skype Email
Top