Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	13002 Makeblock	ME BLUETOOTH MODULE (DUAL MODE)	0
	10055 Makeblock	MEGAPI SHIELD FOR 3D PRINTER V1	0
	13402 Makeblock	ME 7-SEGMENT DISPLAY-RED V1	0
	12015 Makeblock	ME DUAL MOTOR DRIVER V1	0
	11044 Makeblock	ME LINE FOLLOWER ARRAY V1	0
	13604 Makeblock	ME POTENTIOMETER V1	0
	11032 Makeblock	ME TEMPERATURE AND HUMIDITY SENS	0
	P3050001 Makeblock	ME TFT LCD SCREEN - 2.4 INCH V1	0
	13603 Makeblock	ME JOYSTICK V1	0
	13005 Makeblock	ME INFRARED RECEIVER DECODE V3	0
	12050 Makeblock	ME HIGH-POWER ENCODER/DC MOTOR D	0
	11028 Makeblock	ME GAS SENSOR V1	0
	13614 Makeblock	ME SLIDE POTENTIOMETER V1	0
	11020 Makeblock	ME TOUCH SENSOR V1	0
	12020 Makeblock	ME ENCODER MOTOR DRIVER V1	0
	11036 Makeblock	ME FLAME SENSOR V1	0
	12040 Makeblock	MEGAPI ENCODER/DC MOTOR DRIVER V	0
	13602 Makeblock	ME 4 BUTTON V1	0
	11040 Makeblock	ME ANGULAR SENSOR V1	0
	13418 Makeblock	LED LIGHT V1	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems