Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
5651

5651

Kitronik

TERMINAL BLOCK BREAKOUT FOR MICR

26

5631

5631

Kitronik

:KLEF PIANO FOR THE MICRO:BIT

10

5693

5693

Kitronik

KITRONIK COMPACT ALL-IN-ONE ROBO

0

5641

5641

Kitronik

ROBOTICS BOARD FOR BBC MICRO:BIT

0

5601

5601

Kitronik

EDGE CONNECTOR BREAKOUT BOARD FO

13

5636

5636

Kitronik

KLIMATE BOARD FOR THE BBC MICRO:

41

5649

5649

Kitronik

MI:SOUND SPEAKER BOARD FOR BBC M

0

5664

5664

Kitronik

MICRO:BIT BREADBOARD BREAKOUT BO

47

5650

5650

Kitronik

:VIEW TEXT32 LCD SCREEN FOR MICR

16

5642

5642

Kitronik

STOP:BIT - TRAFFIC LIGHT FOR BBC

195

5609

5609

Kitronik

PROTOTYPING SYSTEM FOR THE BBC M

0

5623

5623

Kitronik

SERVO:LITE BOARD FOR :MOVE MINI

0

5610-V2

5610-V2

Kitronik

KITRONIK MI:POWER BOARD FOR THE

0

5649-V2

5649-V2

Kitronik

SOUND SPKR BOARD MICRO:BIT V1 &

43

5697

5697

Kitronik

KITRONIK ENVIRONMENTAL CONTROL B

0

5601B

5601B

Kitronik

EDGE CONNECTOR BREAKOUT BOARD FO

58

5620

5620

Kitronik

MOTOR DRIVER FOR BBC MICRO:BIT

21

5672

5672

Kitronik

KITRONIK ZIP HALO HD FOR MICRO:B

2

5610

5610

Kitronik

MI:POWER BOARD FOR THE BBC MICRO

31

5655

5655

Kitronik

KLIP MOTOR DRIVER FOR MICROBIT

40

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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