Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
OM13588UL

OM13588UL

NXP Semiconductors

USB TYPE C SHIELD BOARD

29

8MIC-RPI-MX8

8MIC-RPI-MX8

NXP Semiconductors

8 MICROPHONE BOARD FOR VOICE

30

FRDM-TOUCH

FRDM-TOUCH

NXP Semiconductors

TOUCH BOARD FOR KE1XZ

21

OM2NTA5332

OM2NTA5332

NXP Semiconductors

NTAG 5 DEMO BOARD

10

OM40008UL

OM40008UL

NXP Semiconductors

DEV BOARD MINI IOT BASEBOARD

8

MX8-DSI-OLED1

MX8-DSI-OLED1

NXP Semiconductors

MIPI-DSI 1080P OLED DISPLAY

0

OM5578/PN7150ARDM

OM5578/PN7150ARDM

NXP Semiconductors

EVAL BOARD FOR PN7150

295

OM2NTP5332

OM2NTP5332

NXP Semiconductors

NTAG 5 DEMO BOARD

30

OM5578/PN7150RPIM

OM5578/PN7150RPIM

NXP Semiconductors

EVAL BOARD FOR PN7150

25

OM-SE050ARD

OM-SE050ARD

NXP Semiconductors

SE050 ARDUINO DEV KIT

16

OM5578/PN7150BBBM

OM5578/PN7150BBBM

NXP Semiconductors

EVAL BOARD FOR PN7150

21

TWR-SB0800-36EVB

TWR-SB0800-36EVB

NXP Semiconductors

EVALUATION BOARD - SB0800 SOLEN

0

TWR-CM3120-EVM

TWR-CM3120-EVM

NXP Semiconductors

TOWER BOARD - CM3120 IO-LINK MA

0

OMA100X-SHLD-EVB

OMA100X-SHLD-EVB

NXP Semiconductors

OMA100X-SHLD-EVB

0

OM13099UL

OM13099UL

NXP Semiconductors

DUAL CAN-FD SHIELD BOARD

0

MX8-DSI-OLED1A

MX8-DSI-OLED1A

NXP Semiconductors

OLED DISPLAY MIPI-DSI 1080P

0

OM13790DOCK

OM13790DOCK

NXP Semiconductors

OM13790DOCK

0

QWKS-ETHACC

QWKS-ETHACC

NXP Semiconductors

QWKS-ETHACC

0

TWR-SMPS-LVFB

TWR-SMPS-LVFB

NXP Semiconductors

TOWER SYSTEM PERIPHERAL MODULE

0

OM13790HOST

OM13790HOST

NXP Semiconductors

OM13790HOST

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
RFQ BOM Call Skype Email
Top