Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
ASD2005-R-T TinyCircuits	PROTOTERMINAL INCLUDED NOTSOLDER	0
AST1032 TinyCircuits	0.96" OLED SCREEN WIRELING	11
ASD2021-2-6 TinyCircuits	RIBBONCABLEEXTENDER	18
AST1003 TinyCircuits	CAPACITIVE TOUCH SLIDER WIRELING	3
ASD2511-R-T TinyCircuits	TEMPERATURE/HUMIDITY TINYSHIELD	8
ASD2123-R TinyCircuits	TINYSHIELDWIFI	34
ASD2302-R-C TinyCircuits	DUAL MOTOR TINYSHIELD JST CONNEC	31
ASD2202-R-F TinyCircuits	FLASHMEMORYTINYSHIELD	3
ASD2116-R TinyCircuits	TINYSHIELDBLUETOOTHLOW ENERGYST	4
AST1006-A TinyCircuits	HALL SENSOR (ANALOG) WIRELING	19
ASD2412-R-LG TinyCircuits	TINYSHIELDCIRCLEEDGELEDS GREEN	0
AST1042 TinyCircuits	0.42" OLED SCREEN WIRELING	28
ASD2009-R TinyCircuits	PROTOBOARD NOTOP CONNECTOR	12
AST1037 TinyCircuits	SOIL MOISTURE SENSOR WIRELING	8
AST1018 TinyCircuits	RGB LED 1X WIRELING (2 CONNECTOR	40
AST1013 TinyCircuits	LRA BOARD (LRA MOTOR SOLDERED) W	13
ASD2101-R TinyCircuits	TINYSHIELDUSB&ICP(SIDE MOUNT)	8
ASD2005-R TinyCircuits	PROTOTERMINAL NOTINSTALLED	0
AST1026 TinyCircuits	IR EMITTER BOARD 950NM WIRELING	30
AST1028 TinyCircuits	LARGE BUTTON WIRELING	24

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems