Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
EVAL-ADXL355-PMDZ Analog Devices, Inc.	EVAL-ADXL355-PMDZ	323
MAX33053ESHLD# Maxim Integrated	EVAL MAX33053 TXRX CAN	218
103020006 Seeed	GROVE I2C HUB	234
MIKROE-1677 MikroElektronika	UV CLICK	0
DFR0126 DFRobot	AUDIO ANALYZER	12
MCC 134	THERMOCOUPLE MEASUREMENT DAQ HAT	0
DFR0016 DFRobot	MEGA PROTOTYPING SHIELD FOR ARDU	38
SEN-16295 SparkFun	QWIIC THERMOCOUPLE AMP SCREW TRM	19
2090 Adafruit	2.8 TFT LCD WITH CAP TOUCH BREAK	0
MIKROE-2439 MikroElektronika	GSM/GNSS CLICK	0
MIKROE-2835 MikroElektronika	MIC24055 CLICK	0
MIKROE-2510 MikroElektronika	HEART RATE 4 CLICK	12
LIGHT-01 OSEPP Electronics	OSEPP LIGHT SENSOR MODULE	0
MATRIX.V1E MATRIX Labs	MATRIX VOICE ESP32- 8 MIC & FPGA	204
DEV-15845 SparkFun	TEENSY AUDIO ADAPTER BOARD REV D	82
PIM366 Pimoroni	MLX90640 THERMAL CAMERA BREAKOUT	0
DM160233 Roving Networks / Microchip Technology	I/O STARTER EXTENSION	0
PIM477 Pimoroni	PARTICULATE MATTER SENSOR BREAKO	21
U008 M5Stack	FINGER PRINT UNIT (FPC1020A)	54
MIKROE-1636 MikroElektronika	HIKER CLICK PACK	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems