Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

Part Number	Description / PDF	Quantity
TE0887-03M Trenz Electronic	ICOBOARD 8MBIT SRAM NEW REV	13
MCVEVP-X6DB ARIES Embedded	EVK CYCLONEV SOC-FPGA	12
TE0729-02-02IF-S Trenz Electronic	STARTER KIT XILINX ZYNQ MICROSOM	10
TFPGA-004 Pimoroni	TINYFPGA BX	0
410-398 Digilent, Inc.	USB104 A7: ARTIX-7 FPGA DEVELOPM	8
P0628 Terasic	TERASIC DE10-PRO GX 2800KLE DEVE	0
HINJKIT Alorium Technology	HINJ FPGA IOT SENSOR HUB DEV KIT	15
P0150 Terasic	DEV BOARD CYCLONE V GX STARTER	40
LCMXO3L-6900C-S-EVN Lattice Semiconductor	DEV KIT FOR MACHXO3L	74
DK-DEV-5M570ZN Intel	KIT DEV MAX V 5M570Z	42
EK-10M50F484 Intel	MAX 10 FPGA 10M50 EVAL KIT	0
SPIDERBASE MX10S16 ARIES Embedded	EVALUATIONKIT MAX10 FPGA	0
P0496 Terasic	DE10-NANO CYCLONE V SE SOC KIT	0
P0536 Terasic	DE10-PRO DEV KIT GX 2800KLE	0
6003-410-017 Digilent, Inc.	PYNQ-Z1: PYTHON DEV BOARD	23
DK-DEV-5CEA7N Intel	KIT DEV CYCLONE V E	30
MPF300-EVAL-KIT Roving Networks / Microchip Technology	POLARFIRE EVALUATION KIT	0
ADS8-V3EBZ Analog Devices, Inc.	ADS8-V3 FPGA MOTHERBOARD	0
TE0703-06 Trenz Electronic	SOM CARRIER BOARD 7-SERIES 4X5CM	0
DK-U1-VCU110-G Xilinx	DEV KIT FOR VCU110	2

Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

1. Overview

Evaluation boards for Field-Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs) are hardware platforms designed to test and develop embedded systems using reconfigurable logic. These boards enable engineers to prototype custom digital circuits without permanent integrated circuit fabrication. As key tools in modern electronics development, they support rapid iteration for applications ranging from aerospace systems to consumer electronics.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA Evaluation Board	High logic density, reconfigurable fabric, DSP blocks, high-speed transceivers	5G baseband processing, AI accelerators
CPLD Development Kit	Lower power consumption, non-volatile configuration, simpler architecture	Industrial motor control, protocol bridging
SoC Embedded Board	Combines FPGA fabric with hard processor cores (ARM, RISC-V)	Smart sensors, autonomous vehicle perception systems
Prototype Verification Platform	Multi-FPGA systems with clock/data synchronization	ASIC pre-validation, high-energy physics experiments

3. Structure and Components

Typical evaluation boards include: - FPGA/CPLD chip with BGA packaging - On-board memory (DDR4 SDRAM, QDR SRAM) - Communication interfaces (PCIe Gen4, Gigabit Ethernet, USB 3.2) - Power management circuits with multiple voltage rails - Debug interfaces (JTAG, UART, FTDI chips) - Expansion headers (FMC, PMOD) - Oscillators and clock distribution networks

4. Key Technical Specifications

Parameter	Description
Logic Elements Count	Defines design complexity capacity (e.g., 500K-2M LUTs for high-end FPGAs)
Max Clock Frequency	Determines processing speed (up to 1.6GHz for networking applications)
I/O Count & Standards	Supports LVDS, SSTL, HSTL (e.g., 1024 differential pairs)
Power Consumption	Thermal design power (TDP) range 5W-35W
Memory Bandwidth	Up to 256-bit AXI interfaces with 1866MT/s DDR4
Transceiver Speed	28Gbps/58Gbps serial links for optical communication

5. Application Areas

Major industries include: - Telecommunications (5G NR base stations, optical transport) - Industrial Automation (real-time motion control, machine vision) - Automotive (ADAS sensor fusion, autonomous driving) - Medical Imaging (ultrasound beamforming, MRI reconstruction) - Consumer Electronics (AR/VR video processing) - Scientific Research (particle detector data acquisition)

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Xilinx (AMD)	Zynq UltraScale+ MPSoC ZCU106
Intel (Altera)	Stratix 10 GX 10M Evaluation Board
Lattice Semiconductor	iCE40 UltraPlus Breakout Board
Microchip (Microsemi)	SmartFusion2 SoC FPGA Development Kit
Allwinner (China)	Tang Nano 9K FPGA Module

7. Selection Guidelines

Key considerations: - Match logic density to design complexity with 20% margin - Verify interface compatibility (e.g., PCIe Gen5 vs Gen4) - Assess power delivery capability for worst-case scenarios - Check toolchain support (Vivado, Quartus, Lattice Diamond) - Consider thermal management requirements - Evaluate available IP core ecosystem - Compare cost/performance ratio for production scalability

8. Industry Trends

Emerging trends include: - AI/ML acceleration with quantized neural networks - Heterogeneous integration (photonics, RF components) - Open-source toolchain development (e.g., Yosys, SymbiFlow) - Energy-efficient architectures for edge computing - Increased adoption in safety-critical systems (ISO 26262 compliance) - Growth of RISC-V based FPGA SoCs - China's domestic substitution initiatives (Huawei HiSilicon, Phytium)