Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

Part Number	Description / PDF	Quantity
LCMXO3LF-6900C-S-EVN Lattice Semiconductor	STARTER KIT MACHXO3LF	70
EK-10M08E144 Intel	KIT EVALUATION MAX 10 FPGA	150
V2M-MPS2-0318C Keil (ARM)	CORTEX-M PROTOTYPING SYSTEM+	5
ABX00022 Genuino (Arduino)	ARDUINO MKR VIDOR 4000	24
410-301 Digilent, Inc.	BOARD NETFPGA-SUME	0
DK-DEV-1SMC-H-A Intel	KIT DEV STRATIX 10 MX 16GB	3
EVO M51 Alorium Technology	EVO M51 COMPUTE MODULE (MICROCHI	32
P0553 Terasic	TSOM MODULE	144
P0671 Terasic	APOLLO DEVELOPER KIT	2
M2S010-MKR-KIT Roving Networks / Microchip Technology	SMARTFUSION2 MAKER-BOARD	324
SPIDERBASE S ARIES Embedded	EVALUATIONKIT MAX10 FPGA	15
EPT-5M57-AP-M4 Earth People Technology	MAXV CPLD MEGA DEVELOPMENT BRD	24
410-300 Digilent, Inc.	BOARD GENESYS2 FOR KINTEX-7	49
410-393 Digilent, Inc.	ECLYPSE Z7 ZYNQ-7000 DEV BOARD	4
DK-DEV-1SGX-L-A Intel	STRATIX 10 GX FPGA DEVELOPMENT K	11
410-316 Digilent, Inc.	PROGRAM DEV NEXYS VIDEO	27
A2F-EVAL-KIT-2 Roving Networks / Microchip Technology	KIT EVAL SMARTFUSION A2F	0
410-183 Digilent, Inc.	BOARD FPGA BASYS3 FOR VIVADO	158
TEBA0714-01 Trenz Electronic	SOM SIMPLE BASE ARTIX-7 TE0714	1
410-383-3EG Digilent, Inc.	GENESYS ZU-3EG ZYNQ ULTRASCALE+	11

Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

1. Overview

Evaluation boards for Field-Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs) are hardware platforms designed to test and develop embedded systems using reconfigurable logic. These boards enable engineers to prototype custom digital circuits without permanent integrated circuit fabrication. As key tools in modern electronics development, they support rapid iteration for applications ranging from aerospace systems to consumer electronics.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA Evaluation Board	High logic density, reconfigurable fabric, DSP blocks, high-speed transceivers	5G baseband processing, AI accelerators
CPLD Development Kit	Lower power consumption, non-volatile configuration, simpler architecture	Industrial motor control, protocol bridging
SoC Embedded Board	Combines FPGA fabric with hard processor cores (ARM, RISC-V)	Smart sensors, autonomous vehicle perception systems
Prototype Verification Platform	Multi-FPGA systems with clock/data synchronization	ASIC pre-validation, high-energy physics experiments

3. Structure and Components

Typical evaluation boards include: - FPGA/CPLD chip with BGA packaging - On-board memory (DDR4 SDRAM, QDR SRAM) - Communication interfaces (PCIe Gen4, Gigabit Ethernet, USB 3.2) - Power management circuits with multiple voltage rails - Debug interfaces (JTAG, UART, FTDI chips) - Expansion headers (FMC, PMOD) - Oscillators and clock distribution networks

4. Key Technical Specifications

Parameter	Description
Logic Elements Count	Defines design complexity capacity (e.g., 500K-2M LUTs for high-end FPGAs)
Max Clock Frequency	Determines processing speed (up to 1.6GHz for networking applications)
I/O Count & Standards	Supports LVDS, SSTL, HSTL (e.g., 1024 differential pairs)
Power Consumption	Thermal design power (TDP) range 5W-35W
Memory Bandwidth	Up to 256-bit AXI interfaces with 1866MT/s DDR4
Transceiver Speed	28Gbps/58Gbps serial links for optical communication

5. Application Areas

Major industries include: - Telecommunications (5G NR base stations, optical transport) - Industrial Automation (real-time motion control, machine vision) - Automotive (ADAS sensor fusion, autonomous driving) - Medical Imaging (ultrasound beamforming, MRI reconstruction) - Consumer Electronics (AR/VR video processing) - Scientific Research (particle detector data acquisition)

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Xilinx (AMD)	Zynq UltraScale+ MPSoC ZCU106
Intel (Altera)	Stratix 10 GX 10M Evaluation Board
Lattice Semiconductor	iCE40 UltraPlus Breakout Board
Microchip (Microsemi)	SmartFusion2 SoC FPGA Development Kit
Allwinner (China)	Tang Nano 9K FPGA Module

7. Selection Guidelines

Key considerations: - Match logic density to design complexity with 20% margin - Verify interface compatibility (e.g., PCIe Gen5 vs Gen4) - Assess power delivery capability for worst-case scenarios - Check toolchain support (Vivado, Quartus, Lattice Diamond) - Consider thermal management requirements - Evaluate available IP core ecosystem - Compare cost/performance ratio for production scalability

8. Industry Trends

Emerging trends include: - AI/ML acceleration with quantized neural networks - Heterogeneous integration (photonics, RF components) - Open-source toolchain development (e.g., Yosys, SymbiFlow) - Energy-efficient architectures for edge computing - Increased adoption in safety-critical systems (ISO 26262 compliance) - Growth of RISC-V based FPGA SoCs - China's domestic substitution initiatives (Huawei HiSilicon, Phytium)