| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
BOARD EVAL FOR 12V MIC28304-1 |
23 |
|
 |
Roving Networks / Microchip Technology |
EVAL BOARD HIGH EFF BUCK REG |
4 |
|
 |
Roving Networks / Microchip Technology |
MIC2800 3 OUTPUT PMIC EVALUATION |
0 |
|
 |
Roving Networks / Microchip Technology |
EVAL BOARD HIGH EFF BUCK REG |
4 |
|
 |
Roving Networks / Microchip Technology |
BOARD DEMO MCP1630 BIAS SUPPLY |
4 |
|
 |
Roving Networks / Microchip Technology |
BOARD MCP1640 2CELL BOOST CONV |
6 |
|
 |
Roving Networks / Microchip Technology |
BOARD DEMO FOR MCP16301 D2PAK |
2 |
|
 |
Roving Networks / Microchip Technology |
EVAL BOARD HIGH EFF BUCK REG |
18 |
|
 |
Roving Networks / Microchip Technology |
POE PD MODULE |
1 |
|
 |
Roving Networks / Microchip Technology |
BOARD EVAL TC1303 SWITCHER/LDO |
0 |
|
 |
Roving Networks / Microchip Technology |
BOARD EVAL FOR MCP1663 |
1 |
|
 |
Roving Networks / Microchip Technology |
MCP1642 HIGH CURRENT BOOST CONVE |
1 |
|
 |
Roving Networks / Microchip Technology |
BOARD EVAL FOR MIC26903YJL |
15 |
|
 |
Roving Networks / Microchip Technology |
MIC33M656 6A STEP DOWN MODULE EV |
0 |
|
 |
Roving Networks / Microchip Technology |
MCP19035 HV BUCK CON EVAL BOARD |
0 |
|
 |
Roving Networks / Microchip Technology |
MIC22950 10A SYNCH BUCK REG EVAL |
0 |
|
 |
Roving Networks / Microchip Technology |
MCP1661 FLYBACK CONVERTER REFERE |
0 |
|
 |
Roving Networks / Microchip Technology |
MIC28516 EVALUATION BOARD |
2 |
|
 |
Roving Networks / Microchip Technology |
MIC23356 3A SYNCH BUCK REGULATOR |
0 |
|
 |
Roving Networks / Microchip Technology |
BOARD EVAL FOR MCP1612 |
0 |
|
Evaluation boards (EVBs) for DC/DC and AC/DC switch-mode power supplies (SMPS) are specialized hardware platforms designed to demonstrate and validate the performance of power management integrated circuits (PMICs) and power modules. These boards enable engineers to assess critical parameters such as efficiency, thermal behavior, and dynamic response before integrating power solutions into end systems. With global demand for energy-efficient electronics growing, SMPS evaluation boards play a vital role in accelerating the development of power systems for applications ranging from consumer devices to industrial machinery.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Isolated AC/DC EVBs | Galvanic isolation, safety-certified designs | Medical power supplies, industrial SMPS |
| Non-Isolated DC/DC EVBs | Compact footprint, high-frequency operation | Point-of-load converters, telecom systems |
| Wide Bandgap (WBG) EVBs | GaN/SiC device evaluation, high-power density | Fast chargers, renewable energy systems |
| Digital Power EVBs | PMBus/PIC interfaces, programmable control | Server power, smart grid equipment |
Typical SMPS evaluation boards consist of: - PCB substrate with 2-10 layers for thermal management - Power stage components: MOSFETs, IGBTs, or wide-bandgap devices - Control circuitry: PWM controllers, gate drivers - Input/Output interfaces: Screw terminals, barrel connectors - Measurement points for voltage/current waveforms - Thermal vias and heatsinks for power dissipation
| Parameter | Description | Importance |
|---|---|---|
| Input Voltage Range | 90-264V AC or 12-48V DC | Defines compatibility with power sources |
| Output Power | 5W-1kW typical | Determines application suitability |
| Efficiency | >85% (varies by topology) | Energy saving and thermal performance |
| Switching Frequency | 20kHz-5MHz | Affects component size and EMI |
| Protection Features | OVP/OCP/OTP | Ensures reliability under faults |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TI (Texas Instruments) | LMG3410EVM-001 | GaN FET evaluation with 1200V rating |
| STMicroelectronics | STEVAL-ISA1850V1 | 650V SiC-based active clamp flyback |
| Infineon | IMW120R048M1H-EVM | WBG evaluation for 1200V/450A systems |
| Analog Devices | LTC7801EV | High-efficiency synchronous buck controller |
Key considerations include: - Matching input/output requirements to application needs - Isolation requirements for safety-critical systems - Availability of design files and software tools - Compliance with standards (e.g., IEC 61558 for medical) - Cost vs. performance trade-offs - Thermal management capabilities
Emerging trends include: - Adoption of GaN/SiC devices enabling >95% efficiency - Integration of digital control via PMBus interfaces - Development of ultra-high-density converters (>100W/cm ) - Emphasis on low EMI designs for automotive applications - Cloud-connected evaluation platforms for remote testing