| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Intel |
EVAL BOARD FOR EN63A0QI |
3 |
|
 |
Intel |
EVAL BOARD FOR EN5311QI |
7 |
|
 |
Intel |
EVAL BOARD FOR EP53F8QI |
0 |
|
 |
Intel |
BOARD EVAL EP6337Q Q100 3A DC-DC |
1 |
|
|
Intel |
EVAL BOARD FOR EL711DI |
0 |
|
|
Intel |
EVALUATION BOARD FOR EM2120H01QI |
11 |
|
|
Intel |
EVAL BOARD EM2030L01QI |
46 |
|
|
Intel |
EVAL BOARD FOR EZ6303QI |
23 |
|
|
Intel |
EVAL BOARD FOR EN5312QI |
0 |
|
|
Intel |
EVAL BOARD FOR EN2392QI |
0 |
|
|
Intel |
EVALUATION BOARD FOR ER6230QI: 3 |
21 |
|
|
Intel |
EVAL BOARD FOR EN29A0QI |
10 |
|
|
Intel |
BOARD EVAL EP53A8L Q100 1A DC-DC |
6 |
|
|
Intel |
EVALUATION BOARD FOR EM2120L01QI |
2 |
|
|
Intel |
EVAL BOARD FOR ER3125 |
0 |
|
|
Intel |
EVAL BOARD EN6361QI |
0 |
|
|
Intel |
EVAL BOARD FOR EN23F2QI |
0 |
|
Evaluation boards (EVBs) for DC/DC and AC/DC switch-mode power supplies (SMPS) are specialized hardware platforms designed to demonstrate and validate the performance of power management integrated circuits (PMICs) and power modules. These boards enable engineers to assess critical parameters such as efficiency, thermal behavior, and dynamic response before integrating power solutions into end systems. With global demand for energy-efficient electronics growing, SMPS evaluation boards play a vital role in accelerating the development of power systems for applications ranging from consumer devices to industrial machinery.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Isolated AC/DC EVBs | Galvanic isolation, safety-certified designs | Medical power supplies, industrial SMPS |
| Non-Isolated DC/DC EVBs | Compact footprint, high-frequency operation | Point-of-load converters, telecom systems |
| Wide Bandgap (WBG) EVBs | GaN/SiC device evaluation, high-power density | Fast chargers, renewable energy systems |
| Digital Power EVBs | PMBus/PIC interfaces, programmable control | Server power, smart grid equipment |
Typical SMPS evaluation boards consist of: - PCB substrate with 2-10 layers for thermal management - Power stage components: MOSFETs, IGBTs, or wide-bandgap devices - Control circuitry: PWM controllers, gate drivers - Input/Output interfaces: Screw terminals, barrel connectors - Measurement points for voltage/current waveforms - Thermal vias and heatsinks for power dissipation
| Parameter | Description | Importance |
|---|---|---|
| Input Voltage Range | 90-264V AC or 12-48V DC | Defines compatibility with power sources |
| Output Power | 5W-1kW typical | Determines application suitability |
| Efficiency | >85% (varies by topology) | Energy saving and thermal performance |
| Switching Frequency | 20kHz-5MHz | Affects component size and EMI |
| Protection Features | OVP/OCP/OTP | Ensures reliability under faults |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TI (Texas Instruments) | LMG3410EVM-001 | GaN FET evaluation with 1200V rating |
| STMicroelectronics | STEVAL-ISA1850V1 | 650V SiC-based active clamp flyback |
| Infineon | IMW120R048M1H-EVM | WBG evaluation for 1200V/450A systems |
| Analog Devices | LTC7801EV | High-efficiency synchronous buck controller |
Key considerations include: - Matching input/output requirements to application needs - Isolation requirements for safety-critical systems - Availability of design files and software tools - Compliance with standards (e.g., IEC 61558 for medical) - Cost vs. performance trade-offs - Thermal management capabilities
Emerging trends include: - Adoption of GaN/SiC devices enabling >95% efficiency - Integration of digital control via PMBus interfaces - Development of ultra-high-density converters (>100W/cm ) - Emphasis on low EMI designs for automotive applications - Cloud-connected evaluation platforms for remote testing