| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
IR (Infineon Technologies) |
BOARD DEMO FOR TLE 6288R |
0 |
|
 |
IR (Infineon Technologies) |
TLE9855 EVALKIT |
2 |
|
 |
IR (Infineon Technologies) |
EVAL CIPOS IKCM10H60GA |
7 |
|
 |
IR (Infineon Technologies) |
1ED3491MX12MTOBO1 DEV KIT |
5 |
|
 |
IR (Infineon Technologies) |
BOARD DEMO FOR TLE6208-3G |
0 |
|
 |
IR (Infineon Technologies) |
EVAL KIT |
11 |
|
 |
IR (Infineon Technologies) |
BTS3125EJ DEMOBOARD |
3 |
|
 |
IR (Infineon Technologies) |
TLE9015QU_TRX_BRG |
4 |
|
 |
IR (Infineon Technologies) |
KIT DES BALLAST 26W IRS2530D |
0 |
|
 |
IR (Infineon Technologies) |
IMOTION CIPOS MINI IFCM15P60GD |
8 |
|
 |
IR (Infineon Technologies) |
EV KIT TLE9879 MOTOR DRIVER |
53 |
|
 |
IR (Infineon Technologies) |
EVAL 1EDN7512B |
10 |
|
 |
IR (Infineon Technologies) |
IR11688 DPAK DAUGHTER |
10 |
|
 |
IR (Infineon Technologies) |
BTS3035TF DEMOBOARD |
3 |
|
 |
IR (Infineon Technologies) |
TLE9012AQU_DTR_BMS2 |
8 |
|
 |
IR (Infineon Technologies) |
SLM 9670 EVAL KIT |
28 |
|
 |
IR (Infineon Technologies) |
KIT DES BALLAST 4LEVEL DIM FLUOR |
0 |
|
 |
IR (Infineon Technologies) |
DEMOBOARD ITS4075Q |
3 |
|
 |
IR (Infineon Technologies) |
EVAL-1EDI60I12AF TO DEMONSTRATE |
11 |
|
 |
IR (Infineon Technologies) |
EVAL_3K3W_TP_PFC_SIC |
0 |
|
Evaluation and Demonstration Boards and Kits are hardware platforms designed to facilitate the development, testing, and demonstration of electronic systems. They serve as critical tools for engineers and developers to prototype applications, validate designs, and accelerate time-to-market. These boards integrate processors, sensors, communication interfaces, and software ecosystems, enabling rapid experimentation across diverse industries such as IoT, automotive, and industrial automation.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microcontroller Development Boards | Embedded CPUs, GPIOs, integrated peripherals | IoT devices, robotics |
| FPGA Evaluation Boards | Reconfigurable logic, high-speed interfaces | Communication systems, AI accelerators |
| Sensor Expansion Kits | Multi-sensor integration (temperature, motion, etc.) | Smart agriculture, environmental monitoring |
| Wireless Communication Modules | Bluetooth/Wi-Fi/LoRa protocols, antenna interfaces | Connected healthcare, smart cities |
Typical architecture includes: - Processing Units: Microcontrollers, FPGAs, or SoCs - Memory: RAM, Flash, EEPROM - Interfaces: USB, UART, SPI, I2C, Ethernet - Power Management: Regulators, battery connectors - Software Stack: SDKs, device drivers, IDEs Physical designs often feature standardized form factors (e.g., Arduino Uno, Raspberry Pi HATs) for modular expansion.
| Parameter | Description |
|---|---|
| Processor Performance (MHz/GHz) | Determines computational capability |
| Memory Capacity (RAM/Flash) | Affects program complexity and data storage |
| Interface Types | Dictates peripheral compatibility |
| Power Consumption (mW/MHz) | Critical for battery-operated devices |
| Operating Temperature (-40 C to +85 C) | Defines environmental durability |
- Internet of Things (IoT): Smart home controllers, edge AI nodes - Automotive: ADAS sensor fusion platforms - Industrial Automation: PLC controllers, predictive maintenance systems - Consumer Electronics: Wearables, AR/VR prototypes
| Manufacturer | Representative Products |
|---|---|
| STMicroelectronics | STM32 Nucleo Series, SensorTile Kit |
| Intel | Intel Edison, Movidius Neural Compute Stick |
| Xilinx | Zynq UltraScale+ MPSoC Evaluation Kit |
| Arduino | Arduino MKR Series, Nano 33 IoT |
Key considerations: 1. Match processor capabilities to application complexity 2. Verify interface compatibility with target peripherals 3. Assess software ecosystem maturity (e.g., ROS support) 4. Evaluate power budget requirements 5. Consider long-term availability and community support
- Growing adoption of RISC-V-based evaluation platforms - Integration of AI/ML accelerators in edge computing boards - Expansion of open-source hardware ecosystems - Increased focus on energy-efficient architectures for IoT - Standardization of form factors (e.g., SparkFun's Qwiic system)