| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Silicon Motion |
SM2246ENAA 2.5" TSOP DEMO BOARD |
0 |
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SM722 LYNX3DM+ 8MB DEMOBOARD |
0 |
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Silicon Motion |
VOYAGER TV ENCODER DAUGHTER BOAR |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 100-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 100-B EM |
0 |
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Silicon Motion |
SM2246XT 2.5" TSOP DEMO BOARD |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 100-B EM |
0 |
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Silicon Motion |
SM718 LYNXSE+S3C6410 DEVELOPMENT |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Silicon Motion |
SM768 FALCON 256MB EXTERNAL DDR3 |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Silicon Motion |
EM3255QX USB DEMO KIT |
0 |
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Silicon Motion |
SM3260NX AD USB3.0 DEMO BOARD |
0 |
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Silicon Motion |
SM712 LYNXEM+ 4MB DEMOBOARD |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 169-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 100-B EM |
0 |
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Silicon Motion |
DEMO KIT FERRI-EMMC BGA 153-B EM |
0 |
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Evaluation and Demonstration Boards and Kits are hardware platforms designed to facilitate the development, testing, and demonstration of electronic systems. They serve as critical tools for engineers and developers to prototype applications, validate designs, and accelerate time-to-market. These boards integrate processors, sensors, communication interfaces, and software ecosystems, enabling rapid experimentation across diverse industries such as IoT, automotive, and industrial automation.
| Type | Functional Features | Application Examples |
|---|---|---|
| Microcontroller Development Boards | Embedded CPUs, GPIOs, integrated peripherals | IoT devices, robotics |
| FPGA Evaluation Boards | Reconfigurable logic, high-speed interfaces | Communication systems, AI accelerators |
| Sensor Expansion Kits | Multi-sensor integration (temperature, motion, etc.) | Smart agriculture, environmental monitoring |
| Wireless Communication Modules | Bluetooth/Wi-Fi/LoRa protocols, antenna interfaces | Connected healthcare, smart cities |
Typical architecture includes: - Processing Units: Microcontrollers, FPGAs, or SoCs - Memory: RAM, Flash, EEPROM - Interfaces: USB, UART, SPI, I2C, Ethernet - Power Management: Regulators, battery connectors - Software Stack: SDKs, device drivers, IDEs Physical designs often feature standardized form factors (e.g., Arduino Uno, Raspberry Pi HATs) for modular expansion.
| Parameter | Description |
|---|---|
| Processor Performance (MHz/GHz) | Determines computational capability |
| Memory Capacity (RAM/Flash) | Affects program complexity and data storage |
| Interface Types | Dictates peripheral compatibility |
| Power Consumption (mW/MHz) | Critical for battery-operated devices |
| Operating Temperature (-40 C to +85 C) | Defines environmental durability |
- Internet of Things (IoT): Smart home controllers, edge AI nodes - Automotive: ADAS sensor fusion platforms - Industrial Automation: PLC controllers, predictive maintenance systems - Consumer Electronics: Wearables, AR/VR prototypes
| Manufacturer | Representative Products |
|---|---|
| STMicroelectronics | STM32 Nucleo Series, SensorTile Kit |
| Intel | Intel Edison, Movidius Neural Compute Stick |
| Xilinx | Zynq UltraScale+ MPSoC Evaluation Kit |
| Arduino | Arduino MKR Series, Nano 33 IoT |
Key considerations: 1. Match processor capabilities to application complexity 2. Verify interface compatibility with target peripherals 3. Assess software ecosystem maturity (e.g., ROS support) 4. Evaluate power budget requirements 5. Consider long-term availability and community support
- Growing adoption of RISC-V-based evaluation platforms - Integration of AI/ML accelerators in edge computing boards - Expansion of open-source hardware ecosystems - Increased focus on energy-efficient architectures for IoT - Standardization of form factors (e.g., SparkFun's Qwiic system)