Accessories

Image Part Number Description / PDF Quantity Rfq
10139

10139

Phase Dock Inc.

RASPBERRY PI ZERO MOUNTING ADAPT

25

10141

10141

Phase Dock Inc.

JETSON NANO MOUNTING ADAPTER

25

10142

10142

Phase Dock Inc.

CIRCUIT PLAYGROUND MOUNTING ADAP

25

10120

10120

Phase Dock Inc.

3X4 ELECTRONICS MOUNTING CONNECT

25

10114

10114

Phase Dock Inc.

2X3 ELECTRONICS MOUNTING CONNECT

25

10136

10136

Phase Dock Inc.

RASPBERRY PI 3,4 MOUNTING ADAPTE

25

10143

10143

Phase Dock Inc.

700 PT BREADBOARD MOUNTING ADAPT

25

10140

10140

Phase Dock Inc.

BEAGLEBONE BLACK MOUNTING ADAPTE

25

10137

10137

Phase Dock Inc.

ARDUINO MOUNTING ADAPTER

25

10118

10118

Phase Dock Inc.

1X3 ELECTRONICS MOUNTING CONNECT

25

10113

10113

Phase Dock Inc.

2X2 ELECTRONICS MOUNTING CONNECT

25

10119

10119

Phase Dock Inc.

1X4 ELECTRONICS MOUNTING CONNECT

25

10117

10117

Phase Dock Inc.

1X2 ELECTRONICS MOUNTING CONNECT

25

10138

10138

Phase Dock Inc.

FEATHER OR PARTICLE MOUNTING ADA

25

10116

10116

Phase Dock Inc.

2X5 ELECTRONICS MOUNTING CONNECT

25

10115

10115

Phase Dock Inc.

2X4 ELECTRONICS MOUNTING CONNECT

25

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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